Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same

A method of manufacturing a carrier foil-attached metal foil, comprising:

• preparing a carrier foil, wherein the carrier foil includes copper or aluminum;
• forming an alloy layer on the carrier foil by electrolytic plating or electroless plating, wherein the alloy layer has a thickness 30 nm to 1 μm;
• forming an organic layer on the alloy layer, wherein the organic layer has a thickness 1 nm to 50 nm;
• forming a metal layer on the organic layer, and
• forming a surface roughening layer on the metal layer,
• wherein,
• the alloy layer is formed from a plating solution including a first component containing nickel (Ni) and a second component containing molybdenum (Mo), wherein the alloy layer comprises the first component and the second component and a ratio of the first component and the second component in the alloy layer is a weight ratio of 60 to 80:40 to 20,
• the organic layer is formed from coating a coating solution including a cyclic compound containing two or more nitrogen atoms by immersion, showering, or spray method,
• the nickel (Ni) of the alloy layer prevents the copper or the aluminum of the carrier foil from diffusing into the metal layer,
• the molybdenum (Mo) provides a site where the cyclic compound is bonded,
• the surface roughening layer is formed by going through a primary electroplating and a secondary electroplating,
• the primary electroplating is performed using a first electroplating solution containing 60 to 70 g/L of copper and 150 to 170 g/L of sulfuric acid, and
• the secondary electroplating is performed using a second electroplating solution containing 220 to 240 g/L of copper and 120 to 140 g/L of sulfuric acid.