Selective self-assembled monolayer patterning with sacrificial layer for devices
AssigneeInvenSense, Inc.
InventorsDaesung Lee, Alan Cuthbertson
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Abstract
Selective self-assembled monolayer patterning with sacrificial layer for devices is provided herein. A sensor device can include a handle layer and a device layer that comprises a first side and a second side. First portions of the first side are operatively connected to defined portions of the handle layer. At least one area of the second side comprises an anti-stiction area formed with an anti-stiction coating. The device can also include a Complementary Metal-Oxide-Semiconductor (CMOS) wafer operatively connected to second portions of the second side of the device layer. The CMOS wafer comprises at least one bump stop. The anti-stiction area faces the at least one bump stop.
Claims7
A method of fabricating a sensor device, comprising:
- bonding first portions of a handle layer to a first side of a device layer;
- depositing rough polysilicon over and adjacent a second side of the device layer;
- forming a bonding layer on a first portion of the second side of the device layer;
- forming a sacrificial layer on a second portion of the second side of the device layer;
- etching the device layer;
- after the etching of the device layer, depositing an anti-stiction coating on the device layer, over the sacrificial layer, and over the rough polysilicon;
- removing portions of the anti-stiction coating deposited over of the sacrificial layer and removing the sacrificial layer, resulting in a first remaining portion of the anti-stiction coating that faces a bump stop;
- and
- after the removing of the portions of the anti-stiction coating, bonding the first portion of the second side of the device layer to a Complementary Metal-Oxide-Semiconductor (CMOS) wafer.
Dependencies are inferred from the claim text.