Polishing fluid collection apparatus and methods related thereto
AssigneeApplied Materials, Inc.
InventorsLizhong Sun, Peng Liu, Jianjun Hu
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsLizhong Sun, Peng Liu, Jianjun Hu
Estimating the term…
Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.
A polishing fluid catch basin assembly for a chemical mechanical polishing system, the polishing fluid catch basin assembly comprising:
A polishing system, comprising:
A method of polishing a substrate, comprising:
Dependencies are inferred from the claim text.