US 12,138,670 B2Granted

Substrate treating apparatus and substrate treating method

AssigneeSemes Co., Ltd.

InventorsJunyoung Choi, Jong Doo Lee

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Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

Claims12

Dependent claims

A substrate treating apparatus comprising:

a process chamber configured to provide a treatment space, in which a substrate is treated, in an interior thereof;
a fluid supply unit configured to supply a fluid into the process chamber;
an exhaust unit including an exhaust line, through which the fluid in the process chamber is exhausted;
wherein the fluid supply unit includes:
a supply tank, in which the fluid is stored;
a supply line connecting the supply tank and the process chamber;
a branch line branched from the supply line at a first point of the supply line;
and
a sensor configured to measure a temperature of the fluid around the first point;
and
a controller configured to control the fluid supply unit, and
wherein the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber,
wherein the controller controls the fluid supply unit such that the fluid is drained through the branch line until the fluid in the supply line reaches the a stabilized state shortly before the fluid is supplied into the process chamber, and
wherein the stabilized state is a state, in which the temperature of the fluid around the first point reaches a process temperature, at which the substrate is treated in the process chamber.

11 more elements

A substrate treating apparatus comprising:

a process chamber configured to provide a treatment space, in which a substrate is treated, in an interior thereof;
a fluid supply unit configured to supply a fluid into the process chamber;
and
an exhaust unit including an exhaust line, through which the fluid in the process chamber is exhausted,
wherein the fluid supply unit includes:
a supply tank, in which the fluid is stored;
a first supply line connecting the supply tank and an upper portion of the process chamber, and in which an upper supply valve that adjusts whether the fluid is supplied into the process chamber and an amount of the supplied fluid is installed;
a second supply line connecting the supply tank to a lower portion of the process chamber, wherein the second supply line is provided with a lower supply valve that controls whether the fluid is supplied into the process chamber and adjusts an amount of the supplied fluid is installed;
a branch line branched from a first point of the second supply line, wherein the second supply line is connected to the branch line which is provided with a second valve, and wherein the exhaust line is further connected to the branch line;
a controller configured to control the fluid supply unit;
and
a sensor configured to measure a temperature of the fluid around the first point,
wherein the second supply line further includes:
a first heater configured to heat the fluid;
and
a first valve installed between the first heater and the lower supply valve,
wherein the controller controls the fluid supply unit such that the fluid is drained from the second supply line through the branch line shortly before the fluid is supplied into the process chamber,
wherein the controller controls the lower supply valve, the first heater, the first valve, and the second valve such that the fluid in the second supply line is drained through the branch line until the temperature of the fluid around the first point becomes a first temperature before the fluid is supplied into the process chamber through the second supply line, and
wherein the first point is provided adjacent to the process chamber between the first valve and the lower supply valve.

16 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/369,892Filed 7 Jul 2021
Priority: KR 10-2020-00842798 Jul 2020
Published: US 2022/0008964 A113 Jan 2022
Granted: 12 Nov 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

B08B 7/0021
Cleaning by methods not provided for in a single other subclass or a single group in this subclass: by liquid gases or supercritical fluids
H10P 72/0414
For wet cleaning or washing: using mainly spraying means, e.g. nozzles
B01D 11/0203
Of solids: with a supercritical fluid
B08B 9/0321
By the mechanical action of a moving fluid, e.g. by flushing: using pressurised, pulsating or purging fluid