Vapor phase deposition of organic films
AssigneeASM IP Holding B.V.
InventorsViljami J. Pore, Marko Tuominen, Hannu Huotari
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.
Claims19
An apparatus for organic film deposition, the apparatus comprising:
- a vessel configured to vaporize an organic reactant to form a reactant vapor;
- a reaction space configured to accommodate a substrate;
- a gas distribution block overlying the substrate, the gas distribution block comprising an outlet to an exhaust and a valve for controlling exhaust from the gas distribution block for purging, and the gas distribution block configured to distribute the reactant vapor in the reaction space from over the substrate;
- a gas line fluidly connecting the vessel and the reaction space, the gas line extending through a side of a reactor defining the reaction space to the gas distribution block;
- and
- a control system configured to cause the apparatus to:
- transport the reactant vapor from the vessel to the substrate by way of the gas line such that the reactant vapor enters the gas distribution block through the side of the reactor and is distributed from the gas distribution block;
- maintain the vessel at or above a temperature A;
- maintain the substrate at a temperature B, which is below about 120° C., the temperature B being between 5° C. and 50° C. lower than the temperature A;
- and
- deposit an organic film on the substrate.
An apparatus for organic film deposition, the apparatus comprising:
- a vessel configured for vaporizing an organic reactant to form a reactant vapor;
- a reaction space configured to accommodate a substrate;
- a gas distribution block overlying the substrate in the reaction space, the gas distribution block configured to distribute the reactant vapor from over the substrate, wherein the gas distribution block has separate flow paths for the reactant vapor and a second reactant vapor until reaching the reaction space;
- a gas line fluidly connecting the vessel and the reaction space, the gas line extending through a side of a reactor defining the reaction space to the gas distribution block;
- and
- a control system configured to
- transport the reactant vapor from the vessel to the substrate by way of the gas line such that the reactant vapor enters the reaction space through the side of the reactor and is distributed from the gas distribution block;
- maintain the vessel at or above a temperature A;
- maintain the substrate at a temperature B, which is below about 120° C., the temperature B being between 5° C. and 50° C. lower than the temperature A;
- and
- deposit an organic film on the substrate.
An apparatus for organic film deposition, the apparatus comprising:
- a vessel configured for vaporizing an organic reactant to form a reactant vapor;
- a reaction space configured to accommodate a substrate;
- a gas distribution block overlying the substrate in the reaction space, the gas distribution block configured to distribute the reactant vapor from over the substrate, wherein the gas distribution block comprises a first tube with holes to distribute the reactant vapor and a second tube with holes to distribute a second reactant vapor;
- a gas line fluidly connecting the vessel and the reaction space, the gas line extending through a side of a reactor defining the reaction space to the gas distribution block;
- and
- a control system configured to
- transport the reactant vapor from the vessel to the substrate by way of the gas line such that the reactant vapor enters the reaction space through the side of the reactor and is distributed from the gas distribution block;
- maintain the vessel at or above a temperature A;
- maintain the substrate at a temperature B, which is below about 120° C., the temperature B being between 5° C. and 50° C. lower than the temperature A;
- and
- deposit an organic film on the substrate.
Dependencies are inferred from the claim text.