Systems and methods for low latency modular multiplication
AssigneeIntel Corporation
InventorsMartin Langhammer, Bogdan Mihai Pasca
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsMartin Langhammer, Bogdan Mihai Pasca
Estimating the term…
An integrated circuit device includes multiplier circuitry configured to determine a plurality of columns of subproducts by multiplying a plurality of values. Each column of the plurality of columns includes one or more subproducts of a plurality of subproducts. The integrated circuit device also includes adder circuitry configured to determine a plurality of sums, each sum being a sum of one column of the plurality of columns. A first portion of the adder circuitry associated with a first column of the plurality of columns is configured to receive a first value and second value that are associated with the first column and a third value associated with a second column of the plurality of columns that differs from the first column. The third value is a carry-out value generated by a second portion of the adder circuitry associated with the second column of the plurality of columns.
An integrated circuit device comprising:
A method comprising:
A programmable logic device configurable to be programmed to perform modular multiplication, wherein, when programmed, the programmable logic device comprises:
Dependencies are inferred from the claim text.