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US 12,135,590 B2Granted
Electronic device comprising sensor module
AssigneeSamsung Electronics Co., Ltd.
InventorsByungseon Hwang, Deokhee Lee, Sunggyu Lee
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Abstract
An electronic device is provided. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes a fingerprint recognition sensor, a protective layer covering the fingerprint recognition sensor, an adhesive member placed on the protective layer, and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.
Claims16
An electronic device comprising:
- a housing;
- and
- sensor circuitry disposed in at least a portion of the housing,
- wherein the sensor circuitry comprises:
- a fingerprint recognition sensor;
- a protection layer enclosing the fingerprint recognition sensor;
- an adhesive member disposed on the protection layer;
- and
- a ceramic layer disposed on the adhesive member, and
- wherein a periphery of the ceramic layer, a periphery of the adhesive member, and a periphery of one portion of the protection layer comprise a processed surface having a designated slope with respect to one surface of the ceramic layer, and
- wherein the periphery of the ceramic layer, the periphery of the adhesive member, and the periphery of the one portion of the protection layer are coplanar along the designated slope and form an external surface of the sensor circuitry.
8 more elements
Dependencies are inferred from the claim text.