Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent

A composition comprising copper ions, an acid, and at least one polyaminoamide comprising a group of formula L1

• [A-B-A′-Z]n[Y—Z]m (L1)
• wherein
• B is a diacid fragment of formula L2
• A, A′ are amine fragments independently selected from the group consisting of formula L3a
• and formula L3b
• DL1 is selected from the group consisting of
• (a) a chemical bond and
• (b) a divalent group selected from the group consisting of
• (i) C1-C20-alkanediyl which may optionally be interrupted by a double bond, an imino group or is optionally, completely or partially, a constituent of one or more saturated, unsaturated or aromatic 5- to 10-membered rings, and
• (ii) an ether or polyether group of formula L2a
• -(DL10-O-]oDL10- (L2a);
• DL2 is a divalent group selected from the group consisting of
• (a) a linear or branched C1 to C10 alkanediyl, which may optionally be interrupted by NRL10 or O, or substituted by one or more groups NRL10RL11 or ORL10, and
• (b) -DL11-ArL11-DL11-;
• DL10 is C1-C6-alkanediyl;
• DL11 is a C1-C6-alkanediyl;
• ArL11 is a C6 to C10 aromatic moiety;
• DL21, DL22 are independently selected from the group consisting of a linear or branched C1 to C6 alkanediyl;
• DL23 is a C1 to C6 alkanediyl;
• RL1, RL2 are independently selected from the group consisting of C1 to C6 alkyls;
• RL3 is selected from the group consisting of H and C1 to C6 alkyls;
• Y is a co-monomer fragment;
• Z is a divalent coupling fragment of formula L4
• ZL1 is selected from the group consisting of
• (a) a linear or branched C1 to C12 alkanediyl, which may be interrupted by one or more O atoms, and
• (b) a divalent group -DL11-ArL11-DL11-;
• ZL2, ZL3 are independently selected from the group consisting of a chemical bond and hydroxyethanediyl;
• n is an integer of from 1 to 400;
• m is 0 or an integer of from 1 to 400;
• o is an integer of from 1 to 100;
• and
• p is 0 or 1.