Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
AssigneeSK Siltron Co., Ltd.
InventorJae Chel Sung
Life of this patent
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Abstract
The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.
Claims16
A wafer polishing head, comprising:
- a template assembly comprising a base substrate, a guide ring disposed at an edge of the base substrate, an adhesive material configured to adhere the guide ring and the base substrate to each other, a round surface formed on an outer side surface of the guide ring, and an adhesive applied to one surface of the base substrate;
- a first coating layer formed on the round surface;
- a rubber chuck configured to fix the base substrate and to support the template assembly;
- and
- a second coating layer formed on the adhesive and an outer circumferential surface of the guide ring, wherein the first coating layer has a thickness of 2 mm to 5 mm, and the width of the first coating layer is greater than the width of the rounded portion of the guide ring.
A wafer polishing head manufacturing method, comprising:
- coupling a guide ring constituted by a plurality of layers to an edge of a base substrate;
- rounding an edge of the guide ring;
- forming a first coating layer on a rounded edge of the guide ring;
- fixing the base substrate and a rubber chuck to each other;
- and
- forming a second coating layer on an adhesive and an outer circumferential surface of the guide ring from the rubber chuck to the first coating layer, wherein the first coating layer has a thickness of 2 mm to 5 mm, and the width of the first coating layer is greater than the width of the rounded portion of the guide ring.
Dependencies are inferred from the claim text.