Image sensor substrate
AssigneeLG Innotek Co., Ltd.
InventorsJung Shik Baik, Eun Sung Seo, Young Joon Son, Jee Heum Paik, Hae Sik Kim
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Abstract
An image sensor substrate according to an embodiment includes: an insulating layer including a first open region; and a first lead pattern part disposed on the insulating layer, wherein the first lead pattern part includes: a first pattern part disposed on the insulating layer; a connection portion extending from the first pattern part; and a second pattern part connected to the first pattern part through the connection portion, wherein the second pattern part and the connection portion are disposed to fly on a region not overlapped with the insulating layer in a vertical direction.
Claims20
An image sensor substrate comprising:
- an insulating layer including a first open region;
- and
- a first lead pattern part disposed on the insulating layer,
- wherein the first lead pattern part includes:
- a first portion disposed on the insulating layer;
- a second portion extending from the first portion;
- and
- a third portion connected to the first portion through the second portion,
- wherein the second portion is disposed to fly on a region not overlapped with the insulating layer in a vertical direction, and
- wherein the third portion is flown with the second portion, the third portion having a first insertion hole configured to allow a wire to extend therethrough.
An image sensor substrate module comprising:
- an image sensor substrate on which an image sensor configured to capture an image is mounted;
- and
- a substrate holder disposed on the image sensor substrate,
- wherein the image sensor substrate includes:
- an insulating layer including a first open region;
- and
- a first lead pattern part disposed on the insulating layer,
- wherein the substrate holder includes a third open region overlapped with the first open region in a vertical direction,
- wherein the first lead pattern part includes:
- a first pattern part disposed on the insulating layer;
- a connection portion extending from the first pattern part;
- and
- a second pattern part connected to the first pattern part through the connection portion,
- wherein the connection portion is disposed to fly on a region not overlapped with the insulating layer in the vertical direction,
- wherein the second pattern part is flown with the connection portion, the second pattern part including a first insertion hole configured to allow a wire to extend therethrough, and
- wherein the substrate holder includes a second insertion hole overlapping the first insertion hole along the vertical direction and configured to allow the wire to extend therethrough.
An image sensor substrate to support an image sensor, the image sensor substrate comprising:
- an insulating layer defining an opening, an axis of the opening extending in a first direction;
- and
- a first lead pattern part disposed on the insulating layer, the first lead pattern part including:
- a first portion disposed on the insulating layer;
- a second portion extending from the first portion in a direction different than the first direction and not overlapping the insulating layer in the first direction;
- and
- a third portion connected to the first portion through the second portion, the third portion extending from the second portion so as to not overlap the insulating layer in the first direction.
Dependencies are inferred from the claim text.