Liquid resin composition for sealing and electronic component apparatus

A liquid resin composition for sealing, comprising:

• an aliphatic epoxy compound (A),
• an epoxy compound (B) having an aromatic ring in a molecule,
• a nitrogen-containing heterocyclic compound (C),
• a curing agent other than the nitrogen-containing heterocyclic compound (C), and
• an inorganic filler (D);
• wherein the nitrogen-containing heterocyclic compound (C) is present in an amount within a range of from 2 parts by mass to 12 parts by mass with respect to 100 parts by mass in total of epoxy compounds;
• wherein the curing agent other than the nitrogen-containing heterocyclic compound (C) is a liquid acid anhydride, a liquefied phenol, or an aromatic amine, and the curing agent other than the nitrogen-containing heterocyclic compound (C) is present in an amount of less than 0.1 equivalent with respect to 1 equivalent of epoxy compounds in the liquid resin composition;
• and
• wherein the inorganic filler (D) is at least one selected from the group consisting of silicas, calcium carbonate, clay, alumina, silicon nitride, silicon carbide, boron nitride, calcium silicate, potassium titanate, aluminum nitride, beryllia, zirconia, zircon, forsterite, steatite, spinel, mullite, titania, aluminum hydroxide, magnesium hydroxide, zinc borate, and zinc molybdate, and the inorganic filler (D) is present in an amount of at least 77% by mass with respect to a total mass of the composition.