Semiconductor substrate support leveling apparatus

A semiconductor processing system comprising:

• a chamber body comprising sidewalls and a base, the chamber body defining an interior volume;
• a substrate support extending through the base of the chamber body, wherein the substrate support is configured to support a substrate within the interior volume;
• a faceplate positioned within the interior volume of the chamber body, wherein the faceplate defines a plurality of apertures through the faceplate;
• and
• a leveling apparatus seated on the substrate support, wherein the leveling apparatus comprises a plurality of piezoelectric pressure sensors compressibly coupled between two plates of the leveling apparatus, wherein the leveling apparatus is configured to identify parallelism between the substrate support and the faceplate when the leveling apparatus is contacted or compressed against the faceplate by the substrate support.