Dynamic dispatching method for semiconductor manufacturing system

A dynamic dispatching method for a semiconductor manufacturing system, comprising the following steps:

• setting roles and parameters of self-organization units in the semiconductor manufacturing system, and defining key nodes in a production environment;
• constructing a negotiation mechanism between the self-organization units, and designing a decision-making and a dispatching subject equipment self-organization unit (ESOU);
• according to a decision instruction of the dispatching subject ESOU, designing a lot self-organization unit (LSOU) allocation dispatching unit for distinguishing a single-batch processing and a multi-batch processing;
• designing a dispatching mechanism based on the self-organization units to implement a dynamic semiconductor dispatching;
• S1, constructing a processing object lot self-organization unit (LSOU), the processing object LSOU representing a batch of wafer modules that need to be dispatched;
• S2, constructing a recipe self-organization unit (RSOU), the RSOU representing a wafer to-be-dispatched plan in a dispatching process;
• S3, according to batch requirements of a semiconductor dispatching, constituting a batch of multiple kinds of semiconductor wafers for processing on a same equipment, and constructing a batch self-organization unit (BSOU), the BSOU representing multiple dispatching batches composed of a same dispatching plan and using a current same dispatching equipment;
• S4, constructing an equipment self-organization unit (ESOU), the ESOU representing an equipment in a semiconductor system and comprising a multi-batch ESOU and a single-batch ESOU;
• S5:
• a processing resource self-organization unit (PSOU) is constructed for setting corresponding dispatching rules;
• S6, calculating workloads of a non-batch-processing equipment group Lu and a batch-processing equipment group L, respectively,
• Lu=Σi=1nTR+Σi=1nTE (1)
• Lb=(Σi=1nTR)/(maxBatch)+Σi=1nTE (2)
• TR where is a queue processing time in a buffer area of an equipment group;
• TE is a remaining available time of the equipment;
• and maxBatch represents a maximum processing capacity of a current equipment group (in batches);
• S7, calculating the maximum processing capacity Lm of the current equipment group,
• Lm=max {R1, R2, . . . , Rm}* equNum (3)
• Rm represents a processing time of a recipe m in the equipment group;
• and equNum represents a number of the equipment in the equipment group;
• S8, respectively determining whether there are bottlenecks in a non-batch-processing and a batch-processing equipment,
• isNonBatBot
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• queLen where represents a number of lots queued in the buffer area;
• and maxBatch is a maximum number of the batches that can be processed on the equipment;
• S9, to ensure a rapid completion of emergency batches and increase a total on- time delivery rate, randomly selecting a certain proportion of the emergency batches as static batches and setting due dates:
• Di=Σj=1nTpti*1.2
• where Di is the due date of a first batch of products to be delivered;
• and Tpti is the processing time of each step in a i batch;
• and
• S10, dynamically identifying the emergency batches, wherein if one of the batches is likely to be delayed, it will dynamically become one of the emergency batches to ensure on-time delivery, and wherein a method for determining whether the batches can become the emergency batch is:
• isDynEmergency
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• where Tp represents an actual remaining processing time of the batches;
• TT represents a theoretical remaining processing time of the batches;
• and Tpro represents the processing time of the batches in a current step;
• DueDate is a theoretical delivery date, and curTime is a current time.