Polishing apparatus and polishing method
AssigneeEbara Corporation
InventorsYuta Suzuki, Taro Takahashi
Life of this patent
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Abstract
A current detection section detects a current value of a swing shaft motor 14 and generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output.
Claims9
A polishing apparatus for polishing a polishable object, the polishing apparatus comprising:
- a polishing table that can hold a polishing pad;
- a first electric motor that can drive to rotate the polishing table;
- a holding section that can hold the polishable object and press the polishable object against the polishing pad;
- a second electric motor that can drive to rotate the holding section;
- a swing arm for holding the holding section;
- a third electric motor that can swing the swing arm around a swing center of the swing arm;
- detection circuitry configured to detect at least one of an electric current value of one electric motor of the first, second, or third electric motors, a torque command value of the one electric motor, a position command of the one electric motor, and a speed command of the one electric motor and generate a first output;
- first processing circuitry configured to obtain a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between the contact pressure and the first output;
- and
- second processing circuitry configured to obtain a second output corresponding to the contact pressure obtained by the first processing circuitry using second data indicating a correspondence relationship between the contact pressure obtained by the first processing circuitry and the second output,
- wherein the second output is at least one of a corrected electric current value of the one electric motor, a corrected torque command value of the one electric motor, a corrected position command of the one electric motor, or a corrected speed command of the one electric motor, and
- wherein the same second data can be used in a second polishing apparatus to obtain substantially the same second output for the same contact pressure using the same second data in the second polishing apparatus.
Dependencies are inferred from the claim text.