Semiconductor packages with patterns of die-specific information
AssigneeMicron Technology, Inc.
InventorFederico Pio
Life of this patent
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Abstract
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.
Claims18
A semiconductor device comprising:
- an external surface;
- a machine-readable pattern on the external surface, the pattern representing information for operating the semiconductor device,
- wherein the pattern includes a plurality of bit areas, and wherein each of plurality of bit areas includes at least one dot or at least one vacant region.
A semiconductor device package comprising:
- one or more semiconductor devices;
- an external surface;
- a machine-readable pattern on the external surface, the pattern representing information for operating at least one of the one or more semiconductor devices,
- wherein the pattern includes a plurality of bit areas, and wherein each of plurality of bit areas includes at least one dot or at least one vacant region.
A semiconductor device package comprising:
- a semiconductor device;
- an encapsulant having an external surface;
- a machine-readable pattern on the external surface, the pattern representing information for operating the semiconductor device,
- wherein the pattern includes a plurality of bit areas, and wherein each of plurality of bit areas includes at least one dot or at least one vacant region.
Dependencies are inferred from the claim text.