# US 12,130,427 B2 · Laser processing device for forming vias

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- Number: US 12,130,427 B2
- Document ID: US12130427B2
- Status: Granted
- Kind: B2
- Application number: 17/696,537
- Filed: 2022-03-16
- Published: 2023-07-20
- Granted: 2024-10-29
- Earliest claimed: 2022-01-20
- Assignees: E&R Engineering Corporation
- Applicants: E&R Engineering Corporation
- Inventors: Schang-Jing Hon
- Web page: https://patentgrep.com/patent/US12130427B2

## CPC

- G02B 26/105: {with one or more pivoting mirrors or galvano-mirrors (G02B26/101 takes precedence)}
- B23K 26/064: by means of optical elements, e.g. lenses, mirrors or prisms
- B23K 26/0643: {comprising mirrors}
- B23K 26/0648: {comprising lenses}
- B23K 26/0734: {into an annular shape}
- B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K 26/382: by boring
- B23K 26/389: {of fluid openings, e.g. nozzles, jets}
- G02B 5/001: {Axicons, waxicons, reflaxicons}
- G02B 19/0009: {having refractive surfaces only}
- G02B 19/0047: {for use with a light source (G02B19/009, G02B19/0095 take precedence; details of lighting devices in general F21V; non-semiconductor lasers having optical devices external to the laser cavity H01S3/005)}
- G02B 27/0927: {Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat}
- B23K 2103/54: {Glass}
- B23K 2103/56: {being semiconducting}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A laser processing device for forming vias has a galvo mirror module, a first lens, a second lens, a focusing module, and a laser source. The laser source emits a laser beam through the first lens and the second lens to convert the laser beam into an incident ring beam. The galvo mirror module reflects the incident ring beam into a reflected ring beam into the focusing module to convert the reflected ring beam into a Bessel-like beam. The galvo mirror module has a scanning direction and shifts a reflection direction of the reflected ring beam to move an end of the reflected ring beam along the scanning direction. The focusing module has a third lens linearly slid along the scanning direction to reduce variations in shape and laser fluence of the Bessel-like beam focused at different positions.

## Claims

### Claim 1

A laser processing device for forming vias comprising:
a galvo mirror module having an incidence side, a reflection side, and a scanning direction;
a first lens being an axicon lens and located at the incidence side of the galvo mirror module;
a second lens located between the first lens and the galvo mirror module and coaxially aligned with the first lens;
a focusing module located at the reflection side of the galvo mirror module and having a third lens linearly slid along the scanning direction of the galvo mirror module; and
a laser source configured to emit a laser beam through the first lens and the second lens to convert the laser beam into an incident ring beam; wherein
the galvo mirror module is configured to reflect the incident ring beam into a reflected ring beam;
the third lens of the focusing module is configured to covert the reflected ring beam into a Bessel-like beam;
the galvo mirror module is configured to shift a reflection direction of the reflected ring beam to move an end of the reflected ring beam along the scanning direction of the galvo mirror module; and
the third lens is slid to a corresponding position along the scanning direction of the galvo mirror module according to a relative movement of the end of the reflected ring beam.

### Claim 2 (depends on 1)

The laser processing device for forming vias as claimed in claim 1, wherein a fourth lens is located between the second lens and the galvo mirror module, is coaxially aligned with the first lens, and is configured to converge a ring thickness of the incident ring beam.

### Claim 3 (depends on 2)

The laser processing device for forming vias as claimed in claim 2, wherein a beam expander is located between the laser source and the first lens.

### Claim 4 (depends on 3)

The laser processing device for forming vias as claimed in claim 3, wherein the third lens is an axicon lens.

### Claim 5 (depends on 3)

The laser processing device for forming vias as claimed in claim 3, wherein the third lens is a converging lens.

### Claim 6 (depends on 1)

The laser processing device for forming vias as claimed in claim 1, wherein the focusing module has a shifter driving the third lens to slide along the scanning direction of the galvo mirror module.

### Claim 7 (depends on 2)

The laser processing device for forming vias as claimed in claim 2, wherein the focusing module has a shifter driving the third lens to slide along the scanning direction of the galvo mirror module.

### Claim 8 (depends on 3)

The laser processing device for forming vias as claimed in claim 3, wherein the focusing module has a shifter driving the third lens to slide along the scanning direction of the galvo mirror module.

### Claim 9 (depends on 4)

The laser processing device for forming vias as claimed in claim 4, wherein the focusing module has a shifter driving the third lens to slide along the scanning direction of the galvo mirror module.

### Claim 10 (depends on 5)

The laser processing device for forming vias as claimed in claim 5, wherein the focusing module has a shifter driving the third lens to slide along the scanning direction of the galvo mirror module.

### Claim 11 (depends on 6)

The laser processing device for forming vias as claimed in claim 6, wherein the galvo mirror module has at least one rotatable reflecting mirror and at least one galvo driving device driving the at least one reflecting mirror to rotate.

### Claim 12 (depends on 7)

The laser processing device for forming vias as claimed in claim 7, wherein the galvo mirror module has at least one rotatable reflecting mirror and at least one galvo driving device driving the at least one reflecting mirror to rotate.

### Claim 13 (depends on 8)

The laser processing device for forming vias as claimed in claim 8, wherein the galvo mirror module has at least one rotatable reflecting mirror and at least one galvo driving device driving the at least one reflecting mirror to rotate.

### Claim 14 (depends on 9)

The laser processing device for forming vias as claimed in claim 9, wherein the galvo mirror module has at least one rotatable reflecting mirror and at least one galvo driving device driving the at least one reflecting mirror to rotate.

### Claim 15 (depends on 10)

The laser processing device for forming vias as claimed in claim 10, wherein the galvo mirror module has at least one rotatable reflecting mirror and at least one galvo driving device driving the at least one reflecting mirror to rotate.