Connective protective packaging
AssigneePregis Innovative Packaging LLC
InventorThomas D. Wetsch
Life of this patent
Estimating the term…
Abstract
A connective protective packaging element is provided. The connective protective packaging element may include a protective body in a high-density supply configuration. The protective body may be configurable into a low-density configuration for cushioning packaged products. The body may include an exposed surface in the low-density configuration. The connective protective packaging element may also include a bonding element attached to the exposed surface that operably bonds the exposed surface to an abutting surface by contact with the bonding element.
Claims20
A chain of packaging elements in a high-density supply configuration that is configurable into a low-density configuration for protective package cushioning, comprising a plurality of connected packaging elements having a first surface and a second surface, each connected packaging element having a separation region extending therebetween to allow separation of the connected packaging elements, wherein:
- each connected packaging element of the connected packaging elements has a bonding element on an exposed surface thereof;
- the bonding element is configured to operably bond the exposed surface to an abutting surface by contacting the abutting surface with the bonding element when the respective packaging element is in a low-density configuration;
- each of the packaging elements has a release surface of a material adapted to release any of the bonding element in contact therewith so that the bonding element can thereafter bond strongly to the abutting surface;
- and
- the packaging elements are arranged in the high-density supply configuration in which successive layers of the connected packaging elements are placed onto each other, with the bonding elements of the packaging elements in contact with the release surfaces of others of the packaging elements such that the connected packaging elements can be taken out of the high-density supply configuration so that the released bonding elements can thereafter attach the packaging elements to the abutting surface.
Dependencies are inferred from the claim text.