Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof

A method of assembling a semiconductor package comprising:

• mounting a component module having one or more passive components on a split die pad at a first surface of a leadframe, the leadframe having a plurality of insertion terminals, the split die pad, and one or more leads, the mounted component module forms an electrical connection between the insertion terminals and the component module;
• mounting a semiconductor die having an integrated circuit on the split die pad at a second surface of the leadframe which is opposite to the first surface;
• encapsulating one or more of the component module and the semiconductor die with an encapsulant to form the semiconductor package;
• wherein the substrate is a printed circuit board (PCB) comprising the one or more passive components coupled by traces on the PCB;
• and
• wherein the insertion terminals are positioned along a same side of the semiconductor package and outside an encapsulant of the semiconductor package.