Clamping element and method for producing a power semiconductor device
AssigneeHitachi Energy Ltd
InventorsLluis Santolaria, Dominik Truessel, Harald Beyer
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Abstract
A clamping element (9) is specified configured to be pressed to a baseplate (2) of at least one power semiconductor module (1) comprising a mold (4), comprising —at least one contact area (10) being configured to be in direct contact to at least one clamping area (7) of the baseplate (2) being free of the mold (4), and —at least one recess (11) provided in the baseplate, wherein —the recess (11) and the contact area (10) are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.
Claims14
A clamping element configured to be pressed to a baseplate of at least one power semiconductor module comprising a mold, comprising
- at least two contact areas being configured to be in direct contact to at least one clamping area of the baseplate being free of the mold, and
- at least two recesses provided in the clamping element,
- at least two holes, wherein
- at least one recess and at least one contact area are configured to face the baseplate,
- the clamping element is configured to connect the at least one power semiconductor module with a cooler.
Dependencies are inferred from the claim text.