Metal powder sintering paste and method of producing the same, and method of producing conductive material
AssigneeNichia Corporation
InventorsTeppei Kunimune, Masafumi Kuramoto
Life of this patent
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Abstract
There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.
Claims20
A method of producing a semiconductor device, said method comprising:
- providing a metal powder sintering paste, and
- calcining the metal powder sintering paste at a temperature in a range of 160° C. to 300° C. to provide a conductive material,
- wherein in the step of providing, the metal powder sintering paste comprises, as a principal component, silver particles having a median diameter of 0.3 μm to 5 μm, and an anionic surfactant,
- the surfactant is represented by Formula (I) below:
- R1O(CH2CH(R2)O)nCH2COOH (I)
- wherein R1 is a linear or branched alkyl group having at least 7 carbon atoms,
- R2 is any one of —H, —CH3, —CH2CH3, and —CH2CH2CH3, and
- n is in a range of 2 to 5, and
- the content of the silver particles is at least 70% by mass with respect to the paste.
A method of producing a semiconductor device, said method comprising:
- providing a metal powder sintering paste, and
- calcining the metal powder sintering paste at a temperature in a range of 150° C. to 320° C. to provide a conductive material,
- wherein in the step of providing, the metal powder sintering paste comprises, as a principal component, silver particles having a median diameter of 0.3 μm to 5 μm, and an anionic surfactant, and the content of the silver particles is at least 90% by mass with respect to the paste.
Dependencies are inferred from the claim text.