Method of wafer alignment using at resolution metrology on product features
AssigneeASML Netherlands B.V.
InventorsWim Tjibbo Tel, Hermanus Adrianus Dillen, Marc Jurian Kea, Roy Werkman, Weitian Kou
Life of this patent
Estimating the term…
Abstract
A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.
Claims20
A method of determining a distortion component of a substrate, the method comprising:
- obtaining a plurality of position measurements of one or more product features on, or in, a surface of a substrate and of one or more alignment marks of the substrate, wherein the measurements of the one or more product features are referenced to either a positioning system used in displacing the substrate or a plane parallel to the surface of the substrate;
- and
- determining, by a hardware apparatus, a distortion component of the substrate based on the plurality of position measurements.
A non-transitory computer program product configured to cause a hardware apparatus to at least:
- obtain a plurality of position measurements of one or more product features on, or in, a surface of a substrate and of one or more alignment marks of the substrate, wherein the measurements of the one or more product features are referenced to either a positioning system used in displacing the substrate or a plane parallel to the surface of the substrate;
- and
- determine a distortion component of the substrate based on the plurality of position measurements.
A non-transitory computer program product configured to cause a hardware apparatus to at least:
- obtain a plurality of position measurements of one or more product features on, or in, a surface of a substrate taken by an apparatus that inspects or measures using an electron beam, wherein the measurements are referenced to either a positioning system used in displacing the substrate or a plane parallel to the surface of the substrate;
- and
- determine a distortion component of the substrate based on the plurality of position measurements.
Dependencies are inferred from the claim text.