Board material processing composition, board material laminate, and method for manufacturing board material laminate

A method for manufacturing a board material laminate including a first board material impregnated with a board material processing composition, a second board material impregnated with the board material processing composition, and an adhesion layer bonding the first board material and the second board material to each other, the method comprising:

• a boring step of forming a hole by forcing a tip of a rod member into a surface of at least any one of the first board material and the second board material;
• and
• an impregnation step of impregnating the board material with the hole formed, with the board material processing composition,
• wherein the board material processing composition inhibits combustion of the first and second board materials due to heating and comprises
• a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the first and second board materials at the heating,
• a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating, and
• binder particles, being inorganic and hydrophobic, bonding the organic component within the first and second board materials to the carbonization promotion component and the chain inhibition component,
• and wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.

A board material processing composition inhibiting combustion of a board material due to heating, comprising:

• a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating;
• a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating;
• and
• binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component,
• wherein
• the carbonization promotion component includes boric acid,
• the chain inhibition component includes ammonium dihydrogen phosphate, and
• the binder particles include silica sand,
• the board material includes a bored hole in a surface of the board material, and
• the board material processing composition is impregnated in the bored hole.