Additive manufacturing processes and additively manufactured products
AssigneeThe Research Foundation for The State University of New York
InventorsScott N. Schiffres, Arad Azizi
Life of this patent
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Abstract
A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.
Claims20
A manufactured structure, comprising:
- a substrate, having an upper surface adapted to support a powder;
- a solid layer, comprising fused portions of the powder over the upper surface of the substrate, in a regional pattern having at least one void region exposing the substrate;
- and
- an interface layer, between the upper surface substrate and the solid layer, comprising a chemical compound reaction product of the upper surface of the substrate and the powder,
- wherein the solid layer comprises a metal alloy, having between about 1% to about 10% aggregate weight, per weight of the metal alloy, of an element selected from the group consisting of titanium, tin, tantalum, zirconium, vanadium, hafnium, chromium, molybdenum, tungsten, and niobium.
A manufactured structure, comprising:
- a substrate;
- a solid layer, formed by locally heating portions of a powder to a fusion temperature, in a regional pattern having at least one void region;
- and
- an interface layer, between the substrate and the solid layer, comprising a chemical compound reaction product of the substrate and the powder,
- wherein the interface layer comprises at least one of an intermetallic compound, a metal carbide compound, a metal nitride compound, and a metal boride compound, and
- wherein the solid layer comprises a fused metal layer having a plurality of surface re-entrant cavities, configured as a heat sink.
An adhesive interlayer between a surface of a substrate and a fused metal alloy powder configured as a heatsink for the substrate, that is shear resistant and adherent between the substrate and the fused metal alloy powder,
- the fused metal alloy powder comprising between about 1% to about 10% aggregate weight, per weight of the metal alloy, of a reactive element selected from the group consisting of titanium, tin, tantalum, zirconium, vanadium, hafnium, chromium, molybdenum, tungsten, and niobium
- the adhesive interlayer comprising at least one of a metal silicide, a metal carbide, a metal boride, and a metal nitride, formed as a chemical compound reaction product of the metal alloy powder and the substrate under local heating.
Dependencies are inferred from the claim text.