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US 12,122,012 B2Granted
Machine for finishing a work piece, and having a highly controllable treatment tool
AssigneeII-Vi Delaware, Inc.
InventorsEdward J. Gratrix, Brian J. Monti
Life of this patent
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Abstract
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.
Claims23
A machine for treating a surface of a wafer chuck, the machine comprising:
- an input shaft being rotatable about a first longitudinal axis and being movable in three orthogonal directions relative to the surface;
- an adjustment block connected to the input shaft and being rotatable therewith about the first longitudinal axis;
- a treatment tool attached to a tool shaft along a second longitudinal axis, the tool shaft being adjustably connected to the adjustment block, wherein the adjustment block comprises a slot on a bottom adapted to receive the tool shaft therein and allow linear offset adjustment of the first longitudinal axis relative to the second longitudinal axis,
- said treatment tool including a contacting surface configured to contact the surface of the wafer chuck,
- wherein the adjustment block comprises an adjuster screw to allow the linear offset adjustment and the tool shaft is threadedly connected to the adjuster screw such that the tool shaft is adjustable, via the threaded connection, linearly along the adjuster screw.
2 more elements
Dependencies are inferred from the claim text.