# US 12,120,961 B2 · Sensor comprising an interconnect having a carrier film

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- Number: US 12,120,961 B2
- Document ID: US12120961B2
- Status: Granted
- Kind: B2
- Application number: 17/428,347
- Filed: 2020-01-21
- Published: 2022-04-28
- Granted: 2024-10-15
- Earliest claimed: 2019-02-05
- Assignees: Koninklijke Philips N.V.
- Applicants: Koninklijke Philips N.V.
- Inventors: Johannes Wilhelmus Weekamp; Roland Alexander Van De Molengraaf; Arjen Van Der Horst
- Web page: https://patentgrep.com/patent/US12120961B2

## CPC

- G01H 11/08: using piezoelectric devices
- H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}
- B06B 1/0622: {on one surface}
- G10K 11/32: characterised by the shape of the source
- H10N 30/06: Forming electrodes or interconnections, e.g. leads or terminals
- H10N 30/302: {Sensors}
- G01H: MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R)
- G10K: SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR

## Abstract

The present invention relates to a sensor, comprising a sensor element and an interconnect. The interconnect is configured to be arranged at the sensor element. The interconnect comprises at least a carrier film provided with metallic layer. The interconnect is configured to provide an electrical connection for the sensor element. Furthermore a device comprising the sensor and a method of manufacturing the sensor is provided.

## Claims

### Claim 1

A sensor, comprising:
a sensor element with two opposite sides and a lateral side;
an interconnect comprising an electrically insulating flexible carrier configured for electrical conduction, wherein the carrier comprises two terminal segments at two opposite sides of a central segment, wherein the first of the two terminal segments is folded over the first side of the two opposite sides of the sensor element, wherein the central segment of the carrier is located adjacent to the lateral side of the sensor element and the second of the two terminal segments is folded over the second side of the two opposite sides of the sensor element,
wherein the carrier is configured to transmit an electrical signal from a first electrode comprised on the first side of the sensor element to the second side of the sensor element to provide an electrical connection of the first electrode from the second side of the sensor element.

### Claim 2 (depends on 1)

The sensor of claim 1, wherein the second side of the sensor element comprises a second electrode, and wherein the sensor element is contactable for both, first and second electrodes from the second side of the sensor element.

### Claim 3 (depends on 1)

The sensor of claim 1, wherein the sensor comprises a further interconnect in electrical connection with the second electrode, and wherein the first and second electrodes are contactable trough the two respective interconnects.

### Claim 4 (depends on 3)

The sensor of claim 3, further comprising a bifilar electrical conductor, wherein each of the interconnects is in electrical connection with one of the conductors of the bifilar electrical conductor.

### Claim 5 (depends on 4)

The sensor of claim 4, wherein a portion of the two interconnects are attached to each other to form a composite interconnect extending from the second side of the sensor element, and wherein each of the electrical conductor of the bifilar electrical conductor is electrically connected on opposite sides of the composite interconnect.

### Claim 6 (depends on 1)

The sensor of claim 1, wherein the sensor element is an ultrasound sensor element, wherein the first side of the ultrasound sensor is configured for acoustical matching for emission and reception of ultrasound waves to and from anatomical media, and wherein the second side of the ultrasound transducer is provided with electrically conductive ultrasound attenuating material.

### Claim 7 (depends on 6)

The sensor of claim 6, wherein the acoustical matching at least partially comprises the first terminal segment of the flexible carrier.

### Claim 8 (depends on 7)

The sensor of claim 7, wherein the thickness of the first terminal segment of the flexible carrier provides the entire acoustical matching for a predetermined central frequency of the ultrasound sensor element.

### Claim 9 (depends on 7)

The sensor of claim 7, wherein the first terminal segment of the flexible carrier is thicker than the central segment.

### Claim 10 (depends on 6)

The sensor of claim 6, wherein the central frequency is above 10 MHz.

### Claim 11 (depends on 1)

The sensor of claim 1, wherein the flexible carrier comprises one of the materials: polyethylene terephthalate, polypropylene and polyimide.

### Claim 12 (depends on 1)

An interventional medical device, comprising:
a sensor according to claim 1;
a housing for receiving the sensor; and
an elongate body to which the housing is attached.