# US 12,120,925 B2 · Descending etching resistance in advanced substrate patterning

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- Number: US 12,120,925 B2
- Document ID: US12120925B2
- Status: Granted
- Kind: B2
- Application number: 18/301,805
- Filed: 2023-04-17
- Published: 2023-08-10
- Granted: 2024-10-15
- Earliest claimed: 2021-08-04
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Chung-chia Chen; Ji Young Choung; Dieter Haas; Yu-hsin Lin; Jungmin Lee; Wen-Hao Wu; Si Kyoung Kim
- Web page: https://patentgrep.com/patent/US12120925B2

## CPC

- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/173: comprising banks or shadow masks
- H10K 59/873: {Encapsulations}
- H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K 2102/00: Constructional details relating to the organic devices covered by this subclass
- H10K 2102/351: {Thickness}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

## Claims

### Claim 1

A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate; and
a plurality of overhang structures, each overhang structure defined by an extension of a second structure extending laterally past a first structure, each first structure disposed over an upper surface of each PDL structure, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels including a first sub-pixel and a second sub-pixel;
the first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material; and
a first encapsulation layer disposed over the first cathode, extending under the adjacent overhang structures, and disposed over a topmost surface of the extension of the second structure, the first encapsulation layer having a first thickness; and
the second sub-pixel comprising:
a second anode;
a second organic light-emitting diode (OLED) material disposed over the second anode;
a second cathode disposed over the second OLED material; and
a second encapsulation layer disposed over the second cathode, extending under the adjacent overhang structures, the second encapsulation layer having a second thickness different than the first thickness and is separated from the first encapsulation layer over the topmost surface by a passivation layer disposed on the topmost surface and disposed in a well of the second sub-pixel.

### Claim 2 (depends on 1)

The device of claim 1, wherein the second encapsulation layer of the second sub-pixel extends under the adjacent overhang structures and contacts a portion of a sidewall of the first structure and a bottom surface of the second structure.

### Claim 3 (depends on 1)

The device of claim 1, further comprising a third sub-pixel comprising:
a third anode;
a third organic light-emitting diode (OLED) material disposed over the third anode;
a third cathode disposed over the third OLED material; and
a third encapsulation layer disposed over the third cathode, extending under the adjacent overhang structures, the third encapsulation layer having a third thickness different than the first thickness and the second thickness.

### Claim 4 (depends on 3)

The device of claim 3, wherein the third encapsulation layer of the third sub-pixel extends under the adjacent overhang structures and contacts a portion of a sidewall of the first structure, and a bottom surface of the second structure, a sidewall of the second structure.

### Claim 5 (depends on 3)

The device of claim 3, wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer comprise a silicon nitride material, silicon oxynitride material, silicon oxide material, or a combination thereof.

### Claim 6 (depends on 3)

The device of claim 3, wherein the first encapsulation layer comprises a material different than at least one of the second encapsulation layer or the third encapsulation layer.

### Claim 7 (depends on 1)

The device of claim 1, wherein the first structure comprises an inorganic material or a metal-containing material.

### Claim 8 (depends on 3)

The device of claim 3, wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer include at least two layers of a silicon-containing material, the at least two layers of the silicon-containing material of at least one the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer is different than each other.

### Claim 9 (depends on 1)

The device of claim 1, wherein the first OLED material is disposed over and in contact with the first anode and is disposed under the overhang structures such that the first OLED material contacts the PDL structure and second OLED material is disposed over and in contact with the second anode and is disposed under the overhang structures such that the second OLED material contacts the PDL structure.

### Claim 10

A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate; and
a plurality of overhang structures, each overhang structure defined by an extension of a second structure extending laterally past a first structure to form an overhang, each first structure disposed over an upper surface of each PDL structure, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels including a first sub-pixel and a second sub-pixel;
the first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material; and
a first encapsulation layer disposed over the first cathode, extending under the adjacent overhang structures, contacting a portion of a sidewall of the overhang structures, and disposed over a topmost surface of the extension of the second structure, the first encapsulation layer having a first thickness; and
the second sub-pixel comprising:
a second anode;
a second organic light-emitting diode (OLED) material disposed over the second sub-pixel;
a second cathode disposed over the second OLED material; and
a second encapsulation layer disposed over the second cathode, extending under the adjacent overhang structures and contacting a portion of a sidewall of the adjacent overhang structures, the second encapsulation layer having a second thickness that is different than the first thickness and is separated from the first encapsulation layer over the topmost surface by a passivation layer disposed on the topmost surface and disposed in a well of the second sub-pixel.

### Claim 11 (depends on 10)

The device of claim 10, wherein in the overhang:
a gap is between a second encapsulation layer on a bottom surface of the second structure and the second encapsulation layer over the second cathode in the overhang; or
the gap is between an underside edge of the second structure and the second encapsulation layer over the second cathode in the overhang.

### Claim 12 (depends on 11)

The device of claim 11, further comprising a third sub-pixel comprising:
a third anode;
a third organic light-emitting diode (OLED) material disposed over the third anode;
a third cathode disposed over the third OLED material; and
a third encapsulation layer disposed over the third cathode, extending under the adjacent overhang structures and contacting a portion of a sidewall of the overhang structures, the third encapsulation layer having a third thickness that is different than the first thickness and the second thickness.

### Claim 13 (depends on 12)

The device of claim 12, wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer comprise a silicon nitride material, silicon oxynitride material, silicon oxide material, or a combination thereof.

### Claim 14 (depends on 10)

The device of claim 10, wherein the first structure comprises an inorganic material or a metal-containing material.

### Claim 15 (depends on 10)

The device of claim 10, wherein the second structure comprises a non-conductive material, an inorganic material, or a metal-containing material.

### Claim 16 (depends on 10)

The device of claim 10, wherein the first cathode extends to contact the PDL structure past an endpoint of the first OLED material and the second cathode extends to contact the PDL structure past an endpoint of the second OLED material.

### Claim 17 (depends on 10)

The device of claim 10, wherein the first OLED material is disposed over and in contact with the first anode and is disposed under the overhang structures such that the first OLED material contacts the PDL structure and the second OLED material is disposed over and in contact with the second anode and is disposed under the overhang structures such that the second OLED material contacts the PDL structure.

### Claim 18

A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate; and
a plurality of overhang structures, each overhang structure defined by an extension of a second structure extending laterally past a first structure to form an overhang, each first structure disposed over an upper surface of each PDL structure, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels including a first sub-pixel, a second sub-pixel, and a third sub-pixel;
the first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material; and
a first encapsulation layer disposed over the first cathode, extending under the adjacent overhang structures, and disposed over a topmost surface of the extension of the second structure, the encapsulation layer having a first thickness;
the second sub-pixel comprising:
a second anode;
a second organic light-emitting diode (OLED) material disposed over the second anode;
a second cathode disposed over the second OLED material; and
a second encapsulation layer disposed over the second cathode, extending under the adjacent overhang structures, the second encapsulation layer having a second thickness that is different than the first thickness and is separated from the first encapsulation layer over the topmost surface by a passivation layer disposed on the topmost surface and disposed in a well of the second sub-pixel; and
the third sub-pixel comprising:
a third anode;
a third organic light-emitting diode (OLED) material disposed over the third anode;
a third cathode disposed over the third OLED material; and
a third encapsulation layer disposed over the third cathode, extending under the adjacent overhang structures, the encapsulation layer having a third thickness that is different than the first thickness and the second thickness.

### Claim 19 (depends on 18)

The device of claim 18, wherein the first thickness of the first encapsulation layer is greater than the second thickness of the second encapsulation layer and the third thickness of the third encapsulation layer, and wherein the second thickness of the second encapsulation layer is greater than the third thickness of the third encapsulation layer.

### Claim 20 (depends on 18)

The device of claim 18, wherein the first thickness of the first encapsulation layer is lesser than the second thickness of the second encapsulation layer and the third thickness of the third encapsulation layer, and wherein the second thickness of the second encapsulation layer is lesser than the third thickness of the third encapsulation layer.
