# US 12,120,923 B2 · Display device and method for manufacturing same

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- Number: US 12,120,923 B2
- Document ID: US12120923B2
- Status: Granted
- Kind: B2
- Application number: 17/267,901
- Filed: 2020-10-20
- Published: 2023-06-15
- Granted: 2024-10-15
- Earliest claimed: 2020-09-08
- Assignees: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Inventors: Yungsheng Chen; Qian Jiang
- Web page: https://patentgrep.com/patent/US12120923B2

## CPC

- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/1201: {Manufacture or treatment}
- H10K 59/873: {Encapsulations}
- H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K 59/124: Insulating layers formed between TFT elements and OLED elements
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

The present application provides a display device and a method for manufacturing the display device. The display device includes a display region and a non-display region. The display device includes an array substrate, a planarization layer, a pixel defining layer, and a protective layer. The planarization layer is disposed on the array substrate. The pixel defining layer is located in the display region. The pixel defining layer is disposed on the planarization layer. The protective layer is located in the non-display region. The protective layer is disposed on the planarization layer.

## Claims

### Claim 1

A display device, wherein the display device comprises a display region and a non-display region, and the display device further comprises:
an array substrate;
a planarization layer disposed on the array substrate;
a pixel defining layer located in the display region, wherein the pixel defining layer is disposed on the planarization layer, the non-display region comprises a first region and a second region, the first region is located near the pixel defining layer, the second region is located away from the pixel defining layer;
a cathode contact layer disposed on the planarization layer in the first region;
a segregating layer disposed on the cathode contact layer, wherein the segregating layer comprises a plurality of through holes penetrating the segregating layer to expose the cathode contact layer, and the segregating layer is configured to divide the cathode contact layer into multiple regions; and
a protective layer located in the non-display region rather than the display region, wherein the protective layer is disposed on the planarization layer.

### Claim 2 (depends on 1)

The display device of claim 1, wherein the protective layer is made of diamond-like carbon.

### Claim 3 (depends on 1)

The display device of claim 1, wherein a thickness of the protective layer ranges from 3 nanometers to 980 nanometers.

### Claim 4 (depends on 1)

The display device of claim 1, wherein the display device further comprises a supporting structure, and the supporting structure is disposed on the pixel defining layer.

### Claim 5 (depends on 4)

The display device of claim 4, wherein the display device further comprises a barricade, the barricade is disposed on the planarization layer in the second region, the protective layer covers the barricade, and a sum of a height of the barricade and a thickness of the protective layer is greater than a height of the supporting structure.

### Claim 6 (depends on 5)

The display device of claim 5, wherein the display device further comprises a dam, and the dam is disposed on the planarization layer in the second region, a height of the dam is less than a height of the barricade.

### Claim 7 (depends on 5)

The display device of claim 5 wherein the display device further comprises a crack blocking dam, and the crack blocking dam is disposed on the planarization layer in the second region, the crack blocking dam is located on a side of the barricade away from the dam.
