# US 12,120,874 B2 · Semiconductor devices having separation regions in gate electrode layers, and data storage systems including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,874 B2 - Document ID: US12120874B2 - Status: Granted - Kind: B2 - Application number: 17/583,265 - Filed: 2022-01-25 - Published: 2022-11-10 - Granted: 2024-10-15 - Earliest claimed: 2021-05-10 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Seonghun Jeong - Web page: https://patentgrep.com/patent/US12120874B2 ## CPC - H10B 41/50: characterised by the boundary region between the core region and the peripheral circuit region - H10B 43/27: the channels comprising vertical portions, e.g. U-shaped channels - H10B 41/10: characterised by the top-view layout - H10B 41/27: the channels comprising vertical portions, e.g. U-shaped channels - H10B 41/35: with a cell select transistor, e.g. NAND - H10B 41/40: characterised by the peripheral circuit region - H10B 43/10: characterised by the top-view layout - H10B 43/35: with cell select transistors, e.g. NAND - H10B 43/40: characterised by the peripheral circuit region - H10B 43/50: characterised by the boundary region between the core and peripheral circuit regions - H10B: ELECTRONIC MEMORY DEVICES ## Abstract Semiconductor devices may include a gate stack including electrode layers stacked alternately with insulating layers and channel structures in the electrode layers and the insulating layers; a cell region insulating layer and an upper support layer on the gate stack; and a separation region in the gate stack and the cell region insulating layer. The separation regions may include a first separation region in the upper support layer and a second separation region below the upper support layer. The first separation region may include a first region in the upper support layer, a second region in the cell region insulating layer, and a third region in the gate electrode layers. The first separation region may further include has a first bend portion in the second region and a second bend portion that may be higher than the first bend portion and uppermost surfaces of the channel structures. ## Claims ### Claim 1 A semiconductor device comprising: a substrate; gate electrode layers on the substrate and spaced apart from each other in a first direction that is perpendicular to an upper surface of the substrate; interlayer insulating layers alternately stacked with the gate electrode layers on the substrate in the first direction; channel structures extending through the gate electrode layers and the interlayer insulating layers, extending in the first direction, and including respective channel layers; a cell region insulating layer on the gate electrode layers and the channel structures; an upper support layer on the cell region insulating layer; and separation regions extending through the gate electrode layers, the interlayer insulating layers, and the cell region insulating layer, extending in the first direction and in a second direction that is parallel to the upper surface of the substrate, and being spaced apart from each other in a third direction that is parallel to the upper surface of the substrate, wherein each of the separation regions comprises a first separation region extending through the upper support layer and extending in the first direction and a second separation region extending between the substrate and a lower surface of the upper support layer in the first direction, wherein the first separation region comprises a first region extending through the upper support layer, a second region extending through the cell region insulating layer, and a third region extending through the gate electrode layers, wherein the first separation region further comprises a first bend portion in the second region and a second bend portion, and the first bend portion is between the substrate and the second bend portion, and wherein uppermost surfaces of the channel structures are between the substrate and the second bend portion. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein the first bend portion comprises a first surface that is parallel to the upper surface of the substrate, and the second bend portion comprises a second surface that is parallel to the upper surface of the substrate. ### Claim 3 (depends on 2) The semiconductor device of claim 2, wherein the first separation region has a first width in the third direction at a height of the first surface and a second width in the third direction at a height of the second surface, and wherein the first width is narrower than the second width. ### Claim 4 (depends on 2) The semiconductor device of claim 2, wherein each of the first surface and the second surface has a uniform width in a cross section taken in a plane parallel to the upper surface of the substrate. ### Claim 5 (depends on 4) The semiconductor device of claim 4, wherein the width of each of the first surface and the second surface is in a range of about 50 nm to about 100 nm. ### Claim 6 (depends on 1) The semiconductor device of claim 1, wherein the second bend portion is in the second region. ### Claim 7 (depends on 1) The semiconductor device of claim 1, wherein the second bend portion is in the first region. ### Claim 8 (depends on 1) The semiconductor device of claim 1, wherein the second bend portion comprises a plurality of second bend portions. ### Claim 9 (depends on 8) The semiconductor device of claim 8, wherein a first one of the plurality of second bend portions is in the first region, and a second one of the plurality of second bend portions is in the second region. ### Claim 10 (depends on 1) The semiconductor device of claim 1, wherein the first bend portion is between the substrate and the uppermost surfaces of the channel structures. ### Claim 11 (depends on 1) The semiconductor device of claim 1, wherein each of the separation regions further comprises: a metal oxide layer that defines a side surface and a bottom surface of the separation region; a first separation insulating layer on the metal oxide layer; and a second separation insulating layer on the first separation insulating layer. ### Claim 12 (depends on 1) The semiconductor device of claim 1, wherein the first separation region comprises a plurality of first separation regions, and wherein, in a cross section taken along the second direction, a ratio of a first length of an uppermost surface of each of the plurality of first separation regions to a second length between uppermost surfaces of directly adjacent ones of the plurality of first separation regions is in a range of about 0.8 to about 5.0. ### Claim 13 A semiconductor device comprising: a substrate; gate electrode layers on the substrate and spaced apart from each other in a first direction that is perpendicular to an upper surface of the substrate; interlayer insulating layers alternately stacked with the gate electrode layers on the substrate in the first direction; channel structures extending through the gate electrode layers and the interlayer insulating layers, extending in the first direction, and including respective channel layers; a cell region insulating layer on the gate electrode layers and the channel structures; and separation regions extending through the gate electrode layers and the cell region insulating layer and extending in the first direction and in a second direction that is parallel to the upper surface of the substrate, wherein each of the separation regions comprises a region extending through the cell region insulating layer and further comprises first and second surfaces that are parallel to upper surface of the substrate and are in the region, and wherein the first surface is between the upper surface of the substrate and the second surface. ### Claim 14 (depends on 13) The semiconductor device of claim 13, further comprising an upper support layer on the cell region insulating layer, wherein each of the separation regions comprises a first separation region extending through the upper support layer and a second separation region not extending through the upper support layer, wherein the first separation region comprises a first region extending through the upper support layer, a second region extending through the cell region insulating layer, and a third region extending through the gate electrode layers, and wherein the first surface and the second surface are in the second region. ### Claim 15 (depends on 14) The semiconductor device of claim 14, wherein the first separation region comprises at least one third surface in the first region that is parallel to the upper surface of the substrate. ### Claim 16 (depends on 14) The semiconductor device of claim 14, wherein the first separation region comprises at least one third surface in the second region that is parallel to the upper surface of the substrate. ### Claim 17 (depends on 14) The semiconductor device of claim 14, wherein each of the first surface and the second surface has a uniform width in a cross section taken in a plane parallel to the upper surface of the substrate. ### Claim 18 (depends on 13) The semiconductor device of claim 13, wherein the first surface has a first width in a cross section taken in a first plane parallel to the upper surface of the substrate, the second surface has a second width taken in a second plane parallel to the upper surface of the substrate, and the first width is narrower than the second width. ### Claim 19 A data storage system comprising: a semiconductor storage device including a substrate, circuit elements on a first side of the substrate, gate electrode layers on the substrate and spaced apart from each other in a first direction that is perpendicular to an upper surface of the substrate, interlayer insulating layers alternately stacked with the gate electrode layers on the substrate in the first direction, channel structures extending through the gate electrode layers and the interlayer insulating layers, extending in the first direction, and including respective channel layers, a cell region insulating layer on the gate electrode layers and the channel structures, separation regions extending through the gate electrode layers and the interlayer insulating layers, and extending in the first direction and in a second direction that is parallel to the upper surface of the substrate, and an input/output pad electrically connected to one of the circuit elements; and a controller electrically connected to the semiconductor storage device through the input/output pad and configured to control the semiconductor storage device, wherein each of the separation regions comprises a region extending through the cell region insulating layer and further comprises first and second surfaces that are parallel to the upper surface of the substrate and are in the region, and wherein the first surface is between the upper surface of the substrate and the second surface. ### Claim 20 (depends on 19) The data storage system of claim 19, further comprising an upper support layer on the cell region insulating layer, wherein each of the separation regions comprises a first separation region extending through the upper support layer and a second separation region not extending through the upper support layer, wherein the first separation region comprises a first region extending through the upper support layer, a second region extending through the cell region insulating layer, and a third region extending through the gate electrode layers, and wherein the first surface and the second surface are in the second region.