# US 12,120,856 B2 · Serviceable and accessible liquid cooled modules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,856 B2 - Document ID: US12120856B2 - Status: Granted - Kind: B2 - Application number: 17/576,778 - Filed: 2022-01-14 - Published: 2023-07-20 - Granted: 2024-10-15 - Earliest claimed: 2022-01-14 - Assignees: Nio Technology (Anhui) Co., Ltd - Applicants: NIO Technology (Anhui) Co., Ltd. - Inventors: Anthony P. Nguyen - Web page: https://patentgrep.com/patent/US12120856B2 ## CPC - H05K 7/20872: {Liquid coolant without phase change} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/1427: {Housings} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A removable subassembly is provided for use in a circuit board module. The removable subassembly includes a cooling element that is decoupled from an enclosure constructed for the circuit board module. The cooling element can be fastened directly to a daughter card or other printed circuit board of the electronic module and can act as part of the enclosure for the circuit board module. By having the cooling element fastened to the daughter card and being part of the enclosure, the daughter card or other components of the circuit board module can be removed without the need for a complete disassembly of the circuit board module. ## Claims ### Claim 1 A removable subassembly, comprising: a cooling element; and a first circuit board secured to the cooling element, wherein the removable subassembly attaches to an enclosure storing a second circuit board, the second circuit board being electrically connected to the first circuit board, wherein the first circuit board is provided between the cooling element and the second circuit board, wherein the cooling element comprises a cold plate, and wherein the removable subassembly is provided within a recess of the enclosure. ### Claim 2 (depends on 1) The removable subassembly of claim 1, wherein the cooling element provides at least a portion of an enclosing surface for the enclosure storing the second circuit board. ### Claim 3 (depends on 1) The removable subassembly of claim 1, wherein a form factor of the cooling element corresponds to a layout of the first circuit board. ### Claim 4 (depends on 1) The removable subassembly of claim 1, wherein the first circuit board is attached directly to the cooling element with one or more fasteners. ### Claim 5 (depends on 1) The removable subassembly of claim 1, further comprising: an input connection on the cooling element; and an output connection on the cooling element, wherein the input connection and the output connection provide a flow of a coolant fluid through channels of the cooling element. ### Claim 6 (depends on 1) The removable subassembly of claim 1, further comprising: a gasket placed between the cooling element and the first circuit board. ### Claim 7 (depends on 1) The removable subassembly of claim 1, wherein the removable subassembly attaches to the second circuit board and the enclosure via one or more fasteners. ### Claim 8 (depends on 1) The removable subassembly of claim 1, wherein the first circuit board, the second circuit board, or both provide a function for a vehicle. ### Claim 9 (depends on 1) The removable subassembly of claim 1, wherein the first circuit board comprises a daughterboard, a printed circuit board daughter card, a printed circuit board, or a combination thereof. ### Claim 10 A circuit board module, comprising: an enclosure; a first circuit board; and a first removable subassembly, wherein the first removable subassembly comprises: a cooling element; and a second circuit board secured to the cooling element, the second circuit board being electrically connected to the first circuit board, wherein the second circuit board is provided between the cooling element and the first circuit board, wherein the cooling element comprises a cold plate, and wherein the first removable subassembly is provided within a recess of the enclosure. ### Claim 11 (depends on 10) The circuit board module of claim 10, wherein the enclosure comprises a plastic material. ### Claim 12 (depends on 10) The circuit board module of claim 10, further comprising: a second removable subassembly, wherein the second removable subassembly comprises: a second cooling element; and a third circuit board secured to the second cooling element, the third circuit board being electrically connected to the first circuit board. ### Claim 13 (depends on 10) The circuit board module of claim 10, wherein the first circuit board, the second circuit board, or both provide a function for a vehicle. ### Claim 14 (depends on 10) The circuit board module of claim 10, wherein a form factor of the enclosure is based at least in part on a size of the first circuit board, a number of removable subassemblies attached to the first circuit board, or a combination thereof. ### Claim 15 (depends on 10) The circuit board module of claim 10, wherein the cooling element of the first removable subassembly provides at least a portion of an enclosing surface for the enclosure. ### Claim 16 (depends on 10) The circuit board module of claim 10, wherein the first circuit board comprises a main printed circuit board, a motherboard, or a combination thereof; and the second circuit board comprises a daughterboard, a printed circuit board daughter card, an additional printed circuit board, or a combination thereof. ### Claim 17 (depends on 10) The circuit board module of claim 10, further comprising: an input connection on the cooling element of the first removable subassembly; and an output connection on the cooling element of the first removable subassembly, wherein the input connection and the output connection provide a flow of a coolant fluid through channels of the cooling element. ### Claim 18 An apparatus, comprising: a cooling element; and a first circuit board secured to the cooling element, wherein the apparatus attaches to an enclosure storing a second circuit board, the second circuit board being electrically connected to the first circuit board, wherein the first circuit board is provided between the cooling element and the second circuit board, wherein the cooling element comprises a cold plate, and wherein the apparatus is provided within a recess of the enclosure. ### Claim 19 (depends on 18) The apparatus of claim 18, wherein the cooling element provides at least a portion of an enclosing surface for the enclosure storing the second circuit board. ### Claim 20 (depends on 18) The apparatus of claim 18, wherein a form factor of the cooling element corresponds to a layout of the first circuit board.