# US 12,120,853 B2 · Electronic device including heat dissipation structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,853 B2 - Document ID: US12120853B2 - Status: Granted - Kind: B2 - Application number: 17/892,264 - Filed: 2022-08-22 - Published: 2022-12-15 - Granted: 2024-10-15 - Earliest claimed: 2020-12-24 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Junwhon Uhm; Hyunmo Yang; Sungkwang Yang; Jongmin Yoon - Web page: https://patentgrep.com/patent/US12120853B2 ## CPC - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)} - G06F 1/163: {Wearable computers, e.g. on a belt} - H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes} - H05K 7/20009: {using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10371: Shields or metal cases - H05K 2201/10378: Interposers - H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract According to an embodiment of the disclosure, a wearable electronic device may include a housing, a first printed circuit board (PCB), a second PCB disposed in parallel with the first PCB, a first interposer, and a second interposer, and the housing may include at least one first opening formed on a first portion, and the first interposer and the second interposer may be disposed between the first PCB and the second PCB, the first interposer and the second interposer may be disposed to have a first end of the first interposer and a second end of the second interposer facing the first end, spaced apart by a designated distance, and a first space between the first end and the second end may be connected to the at least one first opening of the housing. Various other embodiments are possible. ## Claims ### Claim 1 A wearable electronic device comprising: a housing including a first portion in which at least one first opening and a first connection duct are formed; a first printed circuit board (PCB); a second PCB disposed in parallel with the first PCB; a first interposer; and a second interposer, wherein the first interposer and the second interposer are disposed between the first PCB and the second PCB, wherein a first end of the first interposer and a second end of the second interposer facing the first end are spaced apart by a first designated distance, and wherein a first space between the first end and the second end is connected to the at least one first opening of the housing via the first connection duct. ### Claim 2 (depends on 1) The wearable electronic device of claim 1, further comprising: a member for blocking heat, wherein the member is disposed on a side face of the first connection duct. ### Claim 3 (depends on 1) The wearable electronic device of claim 1, wherein the at least one first opening includes a plurality of openings formed in the first portion and having a first width. ### Claim 4 (depends on 1) The wearable electronic device of claim 1, wherein the at least one first opening includes one opening formed in the first portion and having a second width. ### Claim 5 (depends on 1) The wearable electronic device of claim 1, wherein a third end of the first interposer is disposed to be spaced apart from a fourth end of the second interposer facing the third end by a second designated distance, and wherein a second space is disposed between the third end and the fourth end. ### Claim 6 (depends on 5) The wearable electronic device of claim 5, wherein the housing further includes a second portion in which at least one second opening is formed. ### Claim 7 (depends on 6) The wearable electronic device of claim 6, wherein a second connection duct for connecting the second space and the at least one second opening is formed in the second portion. ### Claim 8 (depends on 1) The wearable electronic device of claim 1, further comprising: at least one electronic component disposed on the first PCB; and a shielding member disposed adjacent to the first PCB. ### Claim 9 (depends on 8) The wearable electronic device of claim 8, further comprising a thermal transfer member disposed between the at least one electronic component and the shielding member. ### Claim 10 (depends on 1) The wearable electronic device of claim 1, further comprising a thermal spreader disposed adjacent to the first PCB. ### Claim 11 (depends on 1) The wearable electronic device of claim 1, further comprising a heat dissipation sheet disposed adjacent to the first PCB. ### Claim 12 (depends on 1) The wearable electronic device of claim 1, further comprising a heat dissipation plate disposed adjacent to the first PCB. ### Claim 13 (depends on 1) The wearable electronic device of claim 1, further comprising a porous material disposed in the at least one first opening. ### Claim 14 (depends on 1) The wearable electronic device of claim 1, further comprising: a third PCB disposed in parallel with the second PCB; a third interposer; and a fourth interposer, wherein the third interposer and the fourth interposer are disposed between the second PCB and the third PCB, and wherein a fifth end of the third interposer and a sixth end of the fourth interposer facing the fifth end are spaced apart by a third designated distance. ### Claim 15 A wearable electronic device comprising: a housing forming an exterior of the wearable electronic device, wherein the housing includes a first portion in which at least one first opening and a first connection duct are formed and a second portion in which at least one second opening is formed; a first printed circuit board (PCB); a second PCB disposed in parallel with the first PCB; a first interposer; and a second interposer, wherein the first interposer and the second interposer are disposed between the first PCB and the second PCB, wherein a first end of the first interposer and a second end of the second interposer facing the first end are spaced apart by a first designated distance, wherein a third end of the first interposer and a fourth end of the second interposer facing the third end are spaced apart by a second designated distance, wherein the first portion in which the at least one first opening is formed is adjacent to a first space between the first end and the second end, wherein the second portion in which the at least one second opening is formed is adjacent to a second space between the third end and the fourth end, and wherein the first space is connected to the at least one first opening via the first connection duct. ### Claim 16 (depends on 15) The wearable electronic device of claim 15, further comprising: at least one electronic component disposed on the first PCB; and a shielding member disposed adjacent to the first PCB. ### Claim 17 (depends on 16) The wearable electronic device of claim 16, further comprising a thermal transfer member disposed between the at least one electronic component and the shielding member. ### Claim 18 (depends on 15) The wearable electronic device of claim 15, further comprising a thermal spreader, wherein the thermal spreader is disposed adjacent to the first PCB.