# US 12,120,852 B2 · Composite material and heat dissipation part > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,852 B2 - Document ID: US12120852B2 - Status: Granted - Kind: B2 - Application number: 17/716,162 - Filed: 2022-04-08 - Published: 2022-12-08 - Granted: 2024-10-15 - Earliest claimed: 2021-06-08 - Assignees: The Goodsystem Corp. - Applicants: The Goodsystem Corp. - Inventors: Meoung-whan Cho; Seog-woo Lee; Young-suk Kim - Web page: https://patentgrep.com/patent/US12120852B2 ## CPC - H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties} - C22C 9/00: Alloys based on copper - C22C 21/00: Alloys based on aluminium - H10W 40/25: characterised by their materials - H10W 40/254: {Diamond} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C22C: ALLOYS (treatment of alloys C21D, C22F) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A composite material and a heat dissipation part composed of the composite material are provided. More particularly, a composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix is provided, wherein: the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof; the thermally conductive particles include diamond or SiC; the thermally conductive particles are included at a volume ratio of 15% to 80%; in a microstructure of the composite material, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 200 μm or greater; and the any one thermally conductive particle and the thermally conductive particle most adjacent thereto are not in contact with each other but have a metal matrix therebetween. ## Claims ### Claim 1 A composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix, wherein: the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof; the thermally conductive particles include diamond or SiC; the thermally conductive particles are included at a volume ratio of 15% to 80%; in a microstructure of the composite material, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 200 μm or greater; the any one thermally conductive particle and the thermally conductive particle most adjacent thereto are not in contact with each other but have a metal matrix therebetween; and the thermal conductivity measured after heating the composite material to a temperature in Celsius lower by 20 to 30% than the melting point of the metal matrix has a thermal conductivity degradation rate of 5% or less based on the thermal conductivity thereof before the heating. ### Claim 2 A composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix, wherein: the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof; the thermally conductive particles include diamond or SiC; the thermally conductive particles are included at a volume ratio of 15% to 80%; and in a microstructure of the composite material, the thermally conductive particles include a large particle and a small particle with a particle size difference of 150 μm or greater, wherein: when the large particle is a first particle, and the small particle is a second particle, the distance between the center of the first particle and the center of a first particle most adjacent to the first particle or the second particle is 200 μm or greater; the first particle and the first particle most adjacent thereto or the second particle are not in contact with each other but have a metal matrix therebetween; and the thermal conductivity measured after heating the composite material to a temperature in Celsius lower by 20 to 30% than the melting point of the metal matrix has a thermal conductivity degradation rate of 5% or less based on the thermal conductivity thereof before the heating. ### Claim 3 (depends on 2) The composite material of claim 2, wherein the composite material has a plate shape, and the first particle is disposed at a central region of a cross section in a thickness direction of the plate, and the second particle is disposed close to a surface region of the plate, such that the size of the thermally conductive particle decreases from the central region toward the surface region. ### Claim 4 (depends on 3) The composite material of claim 3, wherein the first particle is arranged at predetermined intervals along a direction perpendicular to the thickness direction of the plate. ### Claim 5 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the particle size of the thermally conductive particle is 300 μm or greater; and when viewed from a top surface plane of the plate into an interior of the plate, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle has a value within ±20% of the median value of distances between the center of all thermally conductive particles and the center of thermally conductive particles most adjacent thereto viewed from the top surface plane of the plate into the interior of the plate. ### Claim 6 (depends on 1) The composite material of claim 1, wherein the metal matrix is composed of Cu or a Cu alloy, and the composite material is buried inside a laminated plate, wherein the laminated plate includes a first layer composed of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and composed of an alloy including copper (Cu) and molybdenum (Mo), a third layer formed on the second layer and composed of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and composed of an alloy including copper (Cu) and molybdenum (Mo), and a fifth layer formed on the fourth layer and composed of copper (Cu) or copper (Cu) alloy. ### Claim 7 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of Cu or a Cu alloy; and on each of upper and lower surfaces of the plate-shaped composite material, a first layer composed of an alloy including copper (Cu) and molybdenum (Mo) is formed, and on the outer surface of each of the first layers, a second layer composed of copper (Cu) or a copper (Cu) alloy is formed. ### Claim 8 (depends on 1) The composite material of claim 1, wherein the composite material has a plate shape, wherein the thermally conductive particles are substantially arranged regularly at predetermined intervals along a plane direction of the plate. ### Claim 9 (depends on 1) The composite material claim 1, wherein the thermally conductive particles are diamond particles, and a metal carbide layer is formed at the interface between the metal matrix and the diamond particles. ### Claim 10 (depends on 9) The composite material of claim 9, wherein the metal carbide is TiC. ### Claim 11 (depends on 1) The composite material of claim 1, wherein the thermally conductive particles are included at a volume ratio of 20% to 80%, and the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 400 μm or greater. ### Claim 12 (depends on 2) The composite material of claim 2, wherein the thermally conductive particles are included at a volume ratio of 20% to 80%, and the distance between the center of the first particle and the center of a first particle most adjacent to the first particle or the second particle is 250 μm or greater. ### Claim 13 (depends on 1) The composite material of claim 1, wherein the thermal conductivity measured after repeating 3 times of heating the composite material to a temperature lower by 20 to 30% than the melting point of the metal matrix and cooling the composite material to room temperature has a thermal conductivity degradation rate of 5% or less based on the thermal conductivity thereof before the initial heating. ### Claim 14 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of copper or a copper alloy and the thermally conductive particles are diamond particles; the thermal conductivity in a thickness direction of the plate shape is 400 W/mK or greater; and the thermal expansion coefficient in a plane direction of the plate shape is 3×10−6/K to 13×10−6/K at 25° C. to 200° C. ### Claim 15 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of silver or a silver alloy and the thermally conductive particles are diamond particles; the thermal conductivity in the thickness direction of the plate shape is 500 W/mK or greater; and the thermal expansion coefficient in the plane direction of the plate shape is 3×10−6/K to 13×10−6/K at 25° C. to 200° C. ### Claim 16 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of copper or a copper alloy and the thermally conductive particles are SiC particles; the thermal conductivity in the thickness direction of the plate shape is 400 W/mK or greater; and the thermal expansion coefficient in the plane direction of the plate shape is 3×10−6/K to 13×10−6/K at 25° C. to 200° C. ### Claim 17 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of magnesium or a magnesium alloy and the thermally conductive particles are diamond particles and/or SiC particles; the thermal conductivity in the thickness direction of the plate shape is 150 W/mK or greater; and the thermal expansion coefficient in the plane direction of the plate shape is 5×10−6/K to 15×10−6/K at 25° C. to 200° C. ### Claim 18 (depends on 1) The composite material of claim 1, wherein: the composite material has a plate shape; the metal matrix is composed of aluminum or an aluminum alloy and the thermally conductive particles are diamond particles and/or SiC particles; the thermal conductivity in the thickness direction of the plate shape is 400 W/mK or greater; and the thermal expansion coefficient in the plane direction of the plate shape is 5×10−6/K to 15×10−6/K at 25° C. to 200° C. ### Claim 19 (depends on 1) A dissipation part comprising the composite material according to claim 1.