# US 12,120,851 B2 · 3-D structured two-phase cooling boilers with nano structured boiling enhancement coating > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,851 B2 - Document ID: US12120851B2 - Status: Granted - Kind: B2 - Application number: 17/725,420 - Filed: 2022-04-20 - Published: 2023-10-26 - Granted: 2024-10-15 - Earliest claimed: 2022-04-20 - Assignees: Microsoft Technology Licensing, LLC - Applicants: Microsoft Technology Licensing, LLC - Inventors: Dennis Trieu; Ioannis Manousakis; Nicholas Andrew Keehn; Husam Atallah Alissa; Bharath Ramakrishnan; Kathryn M. Oseen-Senda; Douglas Patrick Kelley; Alexis Grace Schubert - Web page: https://patentgrep.com/patent/US12120851B2 ## CPC - H05K 7/20381: {Thermal management, e.g. evaporation control} - H05K 7/203: {by immersion} - H05K 7/20309: {Evaporators} - H05K 7/20772: {within server blades for removing heat from heat source} - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/73: for cooling by change of state - H10W 90/00: Package configurations - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader. ## Claims ### Claim 1 A thermal management device comprising: A wicking heat spreader, wherein the wicking heat spreader includes plurality of continuous horizontal rails, the plurality of continuous horizontal rails having a rail width and a rail height, and wherein the plurality of continuous horizontal rails decrease in cross-sectional area towards a center of the wicking heat spreader; and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader. ### Claim 2 (depends on 1) The thermal management device of claim 1, wherein the boiling enhancement surface feature includes at least one protrusion located on the at least one interior surface. ### Claim 3 (depends on 1) The thermal management device of claim 1, wherein the boiling enhancement surface feature includes at least one recess positioned in the at least one interior surface. ### Claim 4 (depends on 3) The thermal management device of claim 3, wherein the at least one recess has a recess surface, and the recess surface has at least one protrusion on the recess surface. ### Claim 5 (depends on 1) The thermal management device of claim 1, wherein the wicking heat spreader includes at least one vertical channel configured to allow fluid flow from a bottom surface of the wicking heat spreader to a top surface of the wicking heat spreader. ### Claim 6 (depends on 5) The thermal management device of claim 5, wherein a vertical channel of the at least one vertical channels is continuous and straight from the bottom surface to the top surface. ### Claim 7 (depends on 1) The thermal management device of claim 1, wherein the wicking heat spreader includes at least one horizontal channel configured to allow fluid flow from a front surface of the wicking heat spreader to a rear surface of the wicking heat spreader. ### Claim 8 (depends on 7) The thermal management device of claim 7, wherein a horizontal channel of the at least one horizontal channels is continuous and straight from the front surface to the rear surface. ### Claim 9 (depends on 1) The thermal management device of claim 1, wherein the wicking heat spreader includes at least one horizontal rail configured to allow thermal conductivity from a front surface of the wicking heat spreader to a rear surface of the wicking heat spreader. ### Claim 10 (depends on 9) The thermal management device of claim 9, wherein a horizontal rail of the at least one horizontal rails is continuous and straight from the front surface to the rear surface. ### Claim 11 (depends on 1) The thermal management device of claim 1, wherein the wicking heat spreader includes at least one vertical rail configured to allow thermal conductivity from a front surface of the wicking heat spreader to a rear surface of the wicking heat spreader. ### Claim 12 (depends on 11) The thermal management device of claim 11, wherein a vertical rail of the at least one vertical rails is continuous and straight from the front surface to the rear surface. ### Claim 13 (depends on 1) The thermal management device of claim 1, wherein the boiling enhancement surface feature is a boiling enhancement coating (BEC) positioned on a surface of a frame of the wicking heat spreader. ### Claim 14 A method of manufacturing a thermal management device, the method comprising: obtaining a frame of a wicking heat spreader, wherein the frame includes at least: a continuous vertical channel configured to allow fluid flow from a bottom surface of the wicking heat spreader to a top surface of the wicking heat spreader, and wherein the continuous vertical channel increases in volume toward the top surface of the wicking heat spreader; a continuous horizontal channel configured to allow fluid flow from a front surface of the wicking heat spreader to a rear surface of the wicking heat spreader, and wherein the continuous horizontal channel increases in volume toward a center of the wicking heat spreader; and forming at least one boiling enhancement surface feature on at least one interior surface of the frame. ### Claim 15 (depends on 14) The method of claim 14, wherein obtaining a frame includes obtaining a first portion of a frame; and the method further comprises additively manufacturing a second portion of the frame after forming the at least one boiling enhancement surface feature. ### Claim 16 (depends on 14) The method of claim 14, wherein forming at least one boiling enhancement surface feature includes additively manufacturing a protrusion on the at least one interior surface of the frame. ### Claim 17 (depends on 14) The method of claim 14, wherein forming at least one boiling enhancement surface feature includes depositing a BEC onto the at least one interior surface of the frame. ### Claim 18 (depends on 14) The method of claim 14, wherein forming at least one boiling enhancement surface feature includes etching the at least one interior surface of the frame to form at least one recess in the at least one interior surface of the frame. ### Claim 19 (depends on 14) The method of claim 14, wherein forming at least one boiling enhancement surface feature includes: forming at least one recess in the at least one interior surface of the frame, and positioning a protrusion in the at least one recess. ### Claim 20 A thermal management device comprising: a thermal interface material (TIM) configured to receive heat from a heat-generating component; an intermediate heat spreader contacting the TIM and configured to receive heat from the TIM; and a wicking heat spreader configured to receive heat from the intermediate heat spreader, wherein the wicking heat spreader includes: a continuous vertical channel configured to allow fluid flow from a bottom surface of the wicking heat spreader to a top surface of the wicking heat spreader, wherein the continuous vertical channel increases in volume towards the top surface of the wicking heat spreader, a continuous horizontal channel configured to allow fluid flow from a front surface of the wicking heat spreader to a rear surface of the wicking heat spreader, wherein the continuous horizontal channel increases in volume toward a center of the wicking heat spreader, and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.