# US 12,120,845 B2 · Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same

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- Number: US 12,120,845 B2
- Document ID: US12120845B2
- Status: Granted
- Kind: B2
- Application number: 18/147,672
- Filed: 2022-12-28
- Published: 2024-07-04
- Granted: 2024-10-15
- Earliest claimed: 2022-12-28
- Assignees: Amulaire Thermal Technology, Inc.
- Applicants: Amulaire Thermal Technology, Inc.
- Inventors: Yi-Hsin Huang; Chun-Lung Wu; Kuo-Wei Lee; Tze-Yang Yeh
- Web page: https://patentgrep.com/patent/US12120845B2

## CPC

- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- H05K 7/20263: {Heat dissipaters releasing heat from coolant}
- H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}
- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

## Claims

### Claim 1

A liquid-cooling heat dissipation plate with unequal height pin-fins, comprising:
a heat dissipation plate body having a first heat dissipation surface and a second heat dissipation surface that face away from each other, wherein the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid;
a plurality of full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body; and
a plurality of non-full-height pin-fins formed at the second heat dissipation surface of the heat dissipation plate body;
wherein a first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid, N is an integer greater than or equal to two, and the plurality of heat sources correspond in position to the first heat dissipation region to the Nth heat dissipation region, respectively;
wherein a ratio of the plurality of full-height pin-fins to pin-fins in a first fifty percent of heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region is less than a ratio of the plurality of full-height pin-fins to pin-fins in a second fifty percent of the heat dissipation regions from the first heat dissipation region to the Nth heat dissipation region.

### Claim 2 (depends on 1)

The liquid-cooling heat dissipation plate according to claim 1, wherein the plurality of full-height pin-fins, the plurality of non-full-height pin-fins, and the heat dissipation plate body are made of copper, copper alloy, aluminum, or aluminum alloy.

### Claim 3 (depends on 1)

The liquid-cooling heat dissipation plate according to claim 1, wherein cross-sections of the plurality of full-height pin-fins and the plurality of non-full-height pin-fins can respectively be round-shaped, ellipse-shaped, rhombus-shaped, rectangle-shaped, drop-shaped, or wing-shaped.

### Claim 4 (depends on 1)

The liquid-cooling heat dissipation plate according to claim 1, wherein a ratio of the plurality of full-height pin-fins to pin-fins in the first heat dissipation region is at least 35%, and a ratio of the plurality of full-height pin-fins to pin-fins in the Nth heat dissipation region is at least 95%.

### Claim 5 (depends on 1)

An enclosed liquid-cooling cooler, comprising the liquid-cooling heat dissipation plate as claimed in claim 1, and a heat dissipation base, wherein a groove is recessed in the heat dissipation base, the heat dissipation base is combined with the heat dissipation plate body so that a chamber is formed between the groove of the heat dissipation base and the second heat dissipation surface of the heat dissipation plate body, such that the plurality of full-height pin-fins and the plurality of non-full-height pin-fins are located in the chamber.