# US 12,120,829 B2 · Wiring circuit board assembly sheet > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,829 B2 - Document ID: US12120829B2 - Status: Granted - Kind: B2 - Application number: 17/913,055 - Filed: 2021-03-05 - Published: 2023-10-26 - Granted: 2024-10-15 - Earliest claimed: 2020-03-24 - Assignees: Nitto Denko Corporation - Applicants: Nitto Denko Corporation - Inventors: Shusaku Shibata; Shun Shiga; Teppei Niino - Web page: https://patentgrep.com/patent/US12120829B2 ## CPC - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)} - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 3/4608: {comprising an electrically conductive base or core} - H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H05K 2203/1545: Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path - H05K 2203/308: Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion. ## Claims ### Claim 1 A wiring circuit board assembly sheet comprising: a metal substrate including a product region and a frame region adjacent to the product region, a wiring circuit structure portion including a terminal portion and disposed on one surface in a thickness direction of the metal substrate in the product region, and a dummy structure portion disposed on one surface in the thickness direction of the metal substrate in the frame region, wherein the dummy structure portion includes a plurality of dummy conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion. ### Claim 2 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the plurality of dummy conductive layers of the dummy structure portion are laminated in the thickness direction. ### Claim 3 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the wiring circuit structure portion includes a wiring portion, and the dummy structure portion has a greater height above the metal substrate than the wiring portion. ### Claim 4 (depends on 3) The wiring circuit board assembly sheet according to claim 3, wherein the wiring portion of the wiring circuit structure portion includes a plurality of conductive layers aligned at spaced intervals from each other in the thickness direction, and the plurality of dummy conductive layers of the dummy structure portion are aligned at spaced intervals from each other in the thickness direction. ### Claim 5 (depends on 4) The wiring circuit board assembly sheet according to claim 4, wherein the terminal portion is thicker than the conductive layer of the wiring portion. ### Claim 6 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the terminal portion includes a plurality of conductive layers laminated in the thickness direction. ### Claim 7 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the dummy structure portion includes an insulating layer covering the dummy conductive layer. ### Claim 8 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the metal substrate extends in a first direction and has a width in a second direction perpendicular to the first direction, the frame region includes an extending portion extending in the first direction and being adjacent to the product region in the second direction, and the dummy structure portion extends in the first direction on the extending portion. ### Claim 9 (depends on 1) The wiring circuit board assembly sheet according to claim 1, wherein the metal substrate extends in a first direction, has a width in a second direction perpendicular to the first direction, and includes at least one row of product region row including a plurality of the product regions aligned in the first direction; the frame region includes at least one extending portion extending in the first direction and being adjacent to the product region row in the second direction; and the dummy structure portion is provided for each extending portion and extends in the first direction on the extending portion.