# US 12,120,822 B2 · Power module with output inductors and output capacitors that are embedded within substrate layers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,822 B2 - Document ID: US12120822B2 - Status: Granted - Kind: B2 - Application number: 17/870,555 - Filed: 2022-07-21 - Published: 2023-08-24 - Granted: 2024-10-15 - Earliest claimed: 2022-02-23 - Assignees: Monolithic Power Systems, Inc. - Applicants: Monolithic Power Systems, Inc. - Inventors: Daocheng Huang; Xinmin Zhang; Yishi Su; Yingxin Zhou; Wenyang Huang - Web page: https://patentgrep.com/patent/US12120822B2 ## CPC - H02M 1/008: {Plural converter units for generating at two or more independent and non-parallel outputs, e.g. systems with plural point of load switching regulators} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H05K 1/0231: {Capacitors or dielectric substances} - H05K 1/0233: {Filters, inductors or a magnetic substance} - H05K 1/165: {incorporating printed inductors} - H05K 1/181: associated with surface mounted components - H02M 3/158: including plural semiconductor devices as final control devices for a single load - H05K 1/0298: {Multilayer circuits} - H05K 2201/10053: Switch - H05K 2201/10378: Interposers - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes. ## Claims ### Claim 1 A power module comprising: a printed circuit board (PCB) comprising an output capacitor substrate layer and an output inductor substrate layer; a first monolithic integrated circuit (IC) switch block mounted on a top surface of the output inductor substrate layer, the first monolithic IC switch block including a first pair of switches, the top surface of the output inductor substrate layer being a topmost surface of the PCB; a second monolithic IC switch block mounted on the top surface of the output inductor substrate layer, the second monolithic IC switch block including a second pair of switches; a first output inductor that is embedded within the output inductor substrate layer, the first output inductor having a first end that is connected to a switch node formed by the first pair of switches and a second end that is connected to a first output voltage node; a second output inductor that is embedded within the output inductor substrate layer, the second output inductor having a first end that is connected to a switch node formed by the second pair of switches and a second end that is connected to a second output voltage node; a first output capacitor that is embedded within the output capacitor substrate layer, the first output capacitor having a first end that is connected to the first output voltage node and a second end that is connected to ground; and a second output capacitor that is embedded within the output capacitor substrate layer, the second output capacitor having a first end that is connected to the second output voltage node and a second end that is connected to ground. ### Claim 2 (depends on 1) The power module of claim 1, wherein the PCB further comprises an interposer substrate layer. ### Claim 3 (depends on 2) The power module of claim 2, wherein the first output voltage node and the second output voltage node are connected to corresponding pins on a bottom surface of the interposer substrate layer, wherein the bottom surface of the interposer substrate layer is a bottommost surface of the PCB. ### Claim 4 (depends on 2) The power module of claim 2, wherein the output capacitor substrate layer is disposed between the output inductor substrate layer and the interposer substrate layer. ### Claim 5 (depends on 4) The power module of claim 4, wherein a top surface of the output capacitor substrate layer contacts a bottom surface of the output inductor substrate layer and a bottom surface of the output capacitor substrate layer contacts a top surface of the interposer substrate layer. ### Claim 6 (depends on 1) The power module of claim 1, wherein the first output capacitor and the second output capacitor each comprises a plurality of discrete capacitors that are connected in parallel. ### Claim 7 (depends on 6) The power module of claim 6, wherein each of the first output capacitor and the second output capacitor is disposed in a cavity within the output capacitor substrate layer. ### Claim 8 A power module comprising: a printed circuit board (PCB) comprising an output capacitor substrate layer and an output inductor substrate layer; a first power converter that generates a first output voltage at a first output voltage node, one or more components of the first power converter being mounted on a topmost surface of the PCB; a first output inductor that is embedded within the output inductor substrate layer, the first output inductor being connected to the first output voltage node; a first output capacitor that is embedded within the output capacitor substrate layer, the first output capacitor having a first end that is connected to the first output voltage node and a second end that is connected to ground, a second power converter that generates a second output voltage at a second output voltage node, one or more components of the second power converter being mounted on the topmost surface of the PCB; a second output inductor that is embedded within the output inductor substrate layer, the second output inductor being connected to the second output voltage node; and a second output capacitor that is embedded within the output capacitor substrate layer, the second output capacitor having a first end that is connected to the second output voltage node and a second end that is connected to ground. ### Claim 9 (depends on 8) The power module of claim 8, wherein each of the first and second output capacitors comprises a plurality of discrete capacitors that are connected in parallel. ### Claim 10 (depends on 9) The power module of claim 9, wherein each of the first and second output capacitors is disposed in a cavity within the output capacitor substrate layer. ### Claim 11 (depends on 9) The power module of claim 9, wherein the PCB further comprises an interposer substrate layer. ### Claim 12 (depends on 11) The power module of claim 11, wherein the output capacitor substrate layer is disposed between the output inductor substrate layer and the interposer substrate layer. ### Claim 13 (depends on 12) The power module of claim 12, wherein the each of the first output voltage node and the second output voltage node is connected to a corresponding pin that is disposed on a bottom surface of the interposer substrate layer, and the bottom surface of the interposer substrate layer is a bottommost surface of the PCB. ### Claim 14 A power module comprising: a printed circuit board (PCB) comprising an output capacitor substrate layer and an output inductor substrate layer; a first monolithic integrated circuit (IC) switch block mounted on a top surface of the output inductor substrate layer, the first monolithic IC switch block comprising a switch that is connected to a first output voltage node; a second monolithic IC switch block mounted on the top surface of the output inductor substrate layer, the second monolithic IC switch block comprising a switch that is connected to a second output voltage node; a first output inductor that is embedded within the output inductor substrate layer, the switch of the first monolithic IC switch block being connected to the first output voltage node by way of the first output inductor; a second output inductor that is embedded within the output inductor substrate layer, the switch of the second monolithic IC switch block being connected to the second output voltage node by way of the second output inductor; a first plurality of discrete capacitors that are connected in parallel, the first plurality of discrete capacitors being embedded within the output capacitor substrate layer, the first plurality of discrete capacitors being connected between the first output voltage node and ground; and a second plurality of discrete capacitors that are connected in parallel, the second plurality of discrete capacitors being embedded within the output capacitor substrate layer, the second plurality of discrete capacitors being connected between the second output voltage node and ground. ### Claim 15 (depends on 14) The power module of claim 14, wherein the PCB further comprises an interposer substrate layer. ### Claim 16 (depends on 15) The power module of claim 15, wherein the output capacitor substrate layer is disposed between the output inductor substrate layer and the interposer substrate layer. ### Claim 17 (depends on 16) The power module of claim 16, wherein the first and second output voltage nodes are connected to corresponding pins on a bottom surface of the interposer substrate layer, and the bottom surface of the interposer substrate layer is a bottommost surface of the PCB. ### Claim 18 (depends on 14) The power module of claim 14, wherein the switch of the first monolithic IC switch block forms a first switch node with another switch of the first monolithic IC switch block, the first output inductor is connected between the first switch node and the first output voltage node, the switch of the second monolithic IC switch block forms a second switch node with another switch of the second monolithic IC switch block, and the second output inductor is connected between the second switch node and the second output voltage node.