# US 12,120,810 B2 · Circuit board and preparation method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,120,810 B2 - Document ID: US12120810B2 - Status: Granted - Kind: B2 - Application number: 17/965,781 - Filed: 2022-10-14 - Published: 2023-02-02 - Granted: 2024-10-15 - Earliest claimed: 2020-12-16 - Assignees: Shennan Circuits Co., Ltd. - Applicants: Shennan Circuits Co., Ltd. - Inventors: Changsheng Tang - Web page: https://patentgrep.com/patent/US12120810B2 ## CPC - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component - H05K 2201/09481: Via in pad; Pad over filled via - H05K 2201/10977: Encapsulated connections - H05K 2203/025: Abrading, e.g. grinding or sand blasting - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Disclosed are a circuit board and its preparation method. The circuit board includes a base layer, a transmission wire layer including multiple conductor tabs, and an insulating and thermally conductive layer including multiple thermally conductive portions. A gap is defined between each adjacent two of the multiple conductor tabs to expose at least a portion of the base layer, and the gap is filled with a corresponding thermally conductive portion. A height of the thermally conductive portion is larger than heights of each adjacent two of the multiple conductor tabs to define a connection groove. The circuit board the disclosure providing enhances heat dissipation performance of circuit boards. ## Claims ### Claim 1 A circuit board, comprising: a base layer; a transmission wire layer, comprising a plurality of conductor tabs; wherein a gap is defined between each adjacent two of the plurality of conductor tabs to expose at least a portion of the base layer; and an insulating and thermally conductive layer, comprising a plurality of thermally conductive portions; wherein each gap is filled with a corresponding insulating and thermally conductive portion, and a height of the corresponding insulating and thermally conductive portion is greater than heights of the each adjacent two of the plurality of conductor tabs to define a connection groove, wherein thermally conductive portion comprises: a first sub thermally conductive portion, wherein the first gap is filled with the first sub thermally conductive portion; and a second sub thermally conductive portion, wherein the second gap is filled with the second sub thermally conductive portion, wherein a height of the first sub thermally conductive portion is greater than heights of each two adjacent corresponding first portions to define a part of a corresponding connection groove on a first side of the connection portion while a height of the second sub thermally conductive portion is greater than heights of each two adjacent corresponding second portions to define a part of another corresponding connection groove on a second side of the connection portion. ### Claim 2 (depends on 1) The circuit board according to claim 1, wherein the circuit board comprises a chip and the connection groove is configured to arrange a solder so that a solder joint position of the chip is connected to a corresponding conductor tab by the solder arranged in the connection groove, while a non-solder joint position of the chip is arranged to the insulating and thermally conductive layer. ### Claim 3 (depends on 1) The circuit board according to claim 1, wherein the conductor tabs penetrate the base layer. ### Claim 4 (depends on 3) The circuit board according to claim 3, wherein each conductor tab comprises: a first portion, extending from a first side of the base layer, wherein a first gap is defined between the first portions of each two adjacent conductor tabs; a second portion, extending from a second side of the base layer, wherein a second gap is defined between the second portions of each two adjacent conductor tabs; and a connection portion, connected to the first portion and the second portion, penetrating the base layer. ### Claim 5 (depends on 3) The circuit board according to claim 3, wherein each conductor tab comprises: a first portion and a connection portion, wherein the first portion extends from a first side of the base layer; wherein the connection portion is connected to the first portion and penetrates the base layer; wherein a first gap is defined between the first portions of each two adjacent conductor tabs; or a second portion and a connection portion, wherein the second portion extends from a second side of the base layer opposite to the first side; wherein the connection portion is connected to the second portion and penetrates the base layer; wherein a second gap is defined between the second portions of each two adjacent conductor tabs. ### Claim 6 (depends on 5) The circuit board according to claim 5, wherein each thermally conductive portion comprises: a first sub thermally conductive portion, wherein the first gap is filled with the first sub thermally conductive portion; wherein a height of the first sub thermally conductive portion is greater than heights of each two adjacent corresponding first portions to define a corresponding connection groove; wherein the insulating and thermally conductive layer comprises a thermally conductive connection portion connected to the first sub thermally conductive portions; or a second sub thermally conductive portion, wherein the second gap is filled with the second sub thermally conductive portion; wherein a height of the second sub thermally conductive portion is greater than heights of each two adjacent corresponding second portions to define a corresponding connection groove; wherein the insulating and thermally conductive layer comprises a thermally conductive connection portion connected to the second sub thermally conductive portions. ### Claim 7 An electronic device, comprising a circuit board; wherein the circuit board comprises: a base layer; a transmission wire layer, comprising a plurality of conductor tabs; wherein a gap is defined between each adjacent two of the plurality of conductor tabs to expose at least a portion of the base layer; and an insulating and thermally conductive layer, comprising a plurality of insulating and thermally conductive portions; wherein each gap is filled with a corresponding insulating and thermally conductive portion, and a height of the corresponding thermally conductive portion is greater than heights of the each adjacent two of the plurality of conductor tabs to define a connection groove, wherein thermally conductive portion comprises: a first sub thermally conductive portion, wherein the first gap is filled with the first sub thermally conductive portion; and a second sub thermally conductive portion, wherein the second gap is filled with the second sub thermally conductive portion, wherein a height of the first sub thermally conductive portion is greater than heights of each two adjacent corresponding first portions to define a part of a corresponding connection groove on a first side of the connection portion while a height of the second sub thermally conductive portion is greater than heights of each two adjacent corresponding second portions to define a part of another corresponding connection groove on a second side of the connection portion. ### Claim 8 (depends on 7) The circuit board according to claim 7, wherein the circuit board comprises a chip and the connection groove is configured to arrange a solder so that a solder joint position of the chip is connected to a corresponding conductor tab by the solder arranged in the connection groove, while a non-solder joint position of the chip is arranged to the insulating and thermally conductive layer. ### Claim 9 (depends on 7) The electronic device according to claim 7, wherein the conductor tabs penetrate the base layer. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein each conductor tab comprises: a first portion, extending from a first side of the base layer, wherein a first gap is defined between the first portions of each two adjacent conductor tabs; a second portion, extending from a second side of the base layer, wherein a second gap is defined between the second portions of each two adjacent conductor tabs; and a connection portion, connected to the first portion and the second portion, penetrating the base layer. ### Claim 11 (depends on 9) The electronic device according to claim 9, wherein each conductor tab comprises: a first portion and a connection portion, wherein the first portion extends from a first side of the base layer; wherein the connection portion is connected to the first portion and penetrates the base layer; wherein a first gap is defined between the first portions of each two adjacent conductor tabs; or a second portion and a connection portion, wherein the second portion extends from a second side of the base layer opposite to the first side; wherein the connection portion is connected to the second portion and penetrates the base layer; wherein a second gap is defined between the second portions of each two adjacent conductor tabs. ### Claim 12 (depends on 11) The electronic device according to claim 11, wherein each thermally conductive portion comprises: a first sub thermally conductive portion, wherein the first gap is filled with the first sub thermally conductive portion; wherein a height of the first sub thermally conductive portion is greater than heights of each two adjacent corresponding first portions to define a corresponding connection groove; wherein the insulating and thermally conductive layer comprises a thermally conductive connection portion connected to the first sub thermally conductive portions; or a second sub thermally conductive portion, wherein the second gap is filled with the second sub thermally conductive portion; wherein a height of the second sub thermally conductive portion is greater than heights of each two adjacent corresponding second portions to define a corresponding connection groove; wherein the insulating and thermally conductive layer comprises a thermally conductive connection portion connected to the second sub thermally conductive portions. ### Claim 13 (depends on 7) The electronic device according to claim 7, wherein the electronic device comprises a chip, wherein a solder joint position of the chip is connected to a corresponding conductor tab through the connection groove with a solder while a non-solder joint position of the chip is arranged to the insulating and thermally conductive layer.