# US 12,119,857 B2 · Multilayer substrate and wireless module mounted substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,857 B2 - Document ID: US12119857B2 - Status: Granted - Kind: B2 - Application number: 17/207,247 - Filed: 2021-03-19 - Published: 2021-09-30 - Granted: 2024-10-15 - Earliest claimed: 2020-03-27 - Assignees: Lapis Semiconductor Co., Ltd. - Applicants: LAPIS Semiconductor Co., Ltd. - Inventors: Shigeki Yamauchi - Web page: https://patentgrep.com/patent/US12119857B2 ## CPC - H01Q 13/206: {Microstrip transmission line antennas} - H04B 1/38: Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving - H01Q 9/42: with folded element, the folded parts being spaced apart a small fraction of the operating wavelength - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04B: TRANSMISSION ## Abstract A multilayer substrate includes a first dielectric layer, a first conductive layer, and a conductor portion. The first dielectric layer has a first region. The first conductive layer is laminated on the first dielectric layer, excluding the first region. The conductor portion has one or more auxiliary conductors disposed at a distance from the first conductive layer, and one or more connecting conductors that connect said one or more auxiliary conductors to the first conductive layer. ## Claims ### Claim 1 A wireless module mounted substrate, comprising: a multilayer substrate comprising a first dielectric layer having a first region, a first conductive layer laminated on the first dielectric layer, excluding the first region, and a conductor portion having one or more auxiliary conductors disposed at a distance from the first conductive layer, and one or more connecting conductors that connect said one or more auxiliary conductors to the first conductive layer; and a wireless module having a main body including a communication circuit, and an antenna connected to the main body, the wireless module being mounted on the multilayer substrate such that the main body is located on the first conductive layer and the antenna is located on the first region of the first dielectric layer; wherein an edge of the first conductive layer opposite the conductor portion extends across a plurality of the auxiliary conductors. ### Claim 2 (depends on 1) The wireless module mounted substrate according to claim 1, wherein said connecting conductors are formed such that a diameter thereof in a direction that intersects with an extension direction is smaller than a diameter of said one or more auxiliary conductors, and the connecting conductors are cuttable. ### Claim 3 (depends on 1) The wireless module mounted substrate according to claim 1, wherein the conductor portion includes at least one auxiliary conductor directly connected to the first conductive layer through the connecting conductor, and another auxiliary conductor connected indirectly to the first conductive layer by being connected to said at least one auxiliary conductor. ### Claim 4 (depends on 1) The wireless module mounted substrate according to claim 1, wherein said one or more auxiliary conductors are formed in the first region of the first dielectric layer. ### Claim 5 (depends on 1) The wireless module mounted substrate according to claim 1, wherein the multilayer substrate has a layered structure in which a plurality of conductive layers including the first conductive layer and a plurality of dielectric layers including the first dielectric layer are alternately laminated, and wherein said one or more auxiliary conductors are formed on one or more of the plurality of dielectric layers. ### Claim 6 (depends on 5) The wireless module mounted substrate according to claim 5, wherein the conductor portion includes a first auxiliary conductor formed in the first region of the first dielectric layer and a second auxiliary conductor formed in a dielectric layer differing from the first dielectric layer among the plurality of dielectric layers, and wherein the first auxiliary conductor and the second auxiliary conductor are connected to each other through a via hole. ### Claim 7 (depends on 1) The wireless module mounted substrate according to claim 1, wherein said one or more auxiliary conductors are placed near the antenna. ### Claim 8 (depends on 1) The wireless module mounted substrate according to claim 1, wherein the first conductive layer includes a part mounting area located between a first group of the plurality of auxiliary conductors and a second group of the plurality of auxiliary conductors. ### Claim 9 A wireless module mounted substrate, comprising: a multilayer substrate comprising a first dielectric layer having a first region, a first conductive layer laminated on the first dielectric layer, excluding the first region, and a conductor portion having a plurality of auxiliary conductors formed in the first region of the first dielectric layer at a distance from the first conductive layer; and a wireless module having a main body including a communication circuit, and an antenna connected to the main body, the wireless module being mounted on the multilayer substrate such that the main body is located on the first conductive layer and the antenna is located on the first region of the first dielectric layer; wherein said plurality of auxiliary conductors each have a first connecting pad, wherein the first conductive layer has a plurality of second connecting pads, and wherein the first connecting pads and the second connecting pads are configured to be connected to each other by connecting lines made of a conductor, and wherein an edge of the first conductive layer opposite the conductor portion extends across a plurality of the auxiliary conductors.