# US 12,119,579 B2 · Female connector and connector assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,579 B2 - Document ID: US12119579B2 - Status: Granted - Kind: B2 - Application number: 17/772,920 - Filed: 2020-12-07 - Published: 2022-11-24 - Granted: 2024-10-15 - Earliest claimed: 2019-10-28 - Assignees: Tianjin Laird Technologies Limited - Applicants: Tianjin Laird Technologies Limited - Inventors: Jingqi Zhao; Jihai Tang; Yifan Xu - Web page: https://patentgrep.com/patent/US12119579B2 ## CPC - H01R 12/718: {Contact members provided on the PCB without an insulating housing (contacts for abutting H01R12/714)} - H01R 12/721: {cooperating directly with the edge of the rigid printed circuits} - H01R 12/774: {Retainers} - H01R 12/775: {Ground or shield arrangements} - H01R 13/6594: the shield being mounted on a PCB and connected to conductive members - H01R 13/6598: Shield material - H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A female connector is connected to a PCB board internally provided with a signal layer and a ground layer. A surface of the PCB board includes conductive pads connected to the signal layer and the ground layer. The female connector includes a female terminal having first and second ends. The second end includes differential signal pairs arranged at intervals and ground pins each located between an adjacent two of the differential signal pairs. The differential signal pairs are connectable to the signal layer through the conductive pads. The ground pins are connectable to the ground layer through the conductive pads. A high-frequency radiation area is in the vicinity of a joint between the differential signal pair and the conductive pad when the first end is mated with a male connector or circuit board. A wave-absorbing material is disposed in a spatial range covered by the high-frequency radiation area. ## Claims ### Claim 1 A female connector configured for being connected to a PCB board that is internally provided with a signal layer and a ground layer, the PCB board being provided on a surface thereof with conductive pads that are connected to the signal layer and the ground layer, wherein the female connector comprises: a female terminal having a first end for mating with a male connector or a gold finger circuit board, and a second end opposite to the first end, the second end being provided with a plurality of differential signal pairs arranged at intervals and ground pins each located between any two adjacent pairs of the differential signal pairs, the differential signal pairs being connectable to the signal layer through the conductive pads, the ground pins being connectable to the ground layer through the conductive pads, and a high-frequency radiation area being formed in the vicinity of a joint between the differential signal pairs and the conductive pads when the first end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area. ### Claim 2 (depends on 1) The female connector according to claim 1, wherein: the PCB board is provided therein with copper deposition holes for connecting the signal layer and the ground layer to a surface of the PCB board; the conductive pads are connected to the signal layer and the ground layer through the copper deposition holes; and the high-frequency radiation area is formed in an area outside the copper deposition holes at the joint between the conductive pads and the differential signal pairs. ### Claim 3 (depends on 1) The female connector according to claim 1, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 4 (depends on 1) The female connector according to claim 1, wherein each of the differential signal pairs comprises two differential signal pins, and wherein: the wave-absorbing material is disposed on the differential signal pins and the ground pins; or the wave-absorbing material is disposed close to the differential signal pins and the ground pins. ### Claim 5 (depends on 4) The female connector according to claim 4, wherein the female terminal is partially wrapped and fixed by a plastic bracket which is accommodated in a shell; the wave-absorbing material is disposed on the plastic bracket and/or the shell and is close to the differential signal pins and the ground pins. ### Claim 6 (depends on 4) The female connector according to claim 4, wherein the wave-absorbing material wraps at least an upper surface of each of the differential signal pins. ### Claim 7 (depends on 6) The female connector according to claim 6, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 8 (depends on 4) The female connector according to claim 4, wherein: a height of the ground pins is greater than that of the differential signal pins; and the wave-absorbing material is an integral structure disposed on upper surfaces of the ground pins and spaced apart from the differential signal pins. ### Claim 9 (depends on 8) The female connector according to claim 8, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins. ### Claim 10 (depends on 8) The female connector according to claim 8, wherein: a surface of the wave-absorbing material is formed with first protrusions corresponding to the plurality of differential signal pairs, each of the first protrusions protruding between two adjacent pins of the ground pins and close to the differential signal pair; and a projection of the first protrusion toward the corresponding differential signal pair covers the two differential signal pins of the differential signal pair. ### Claim 11 (depends on 10) The female connector according to claim 10, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins. ### Claim 12 A connector combination comprising a male connector and a female connector, wherein: the male connector comprises a male terminal; the female connector is configured for being connected to a PCB board that is internally provided with a signal layer and a ground layer, the PCB board being provided on a surface thereof with conductive pads that are connected to the signal layer and the ground layer; and the female connector comprises: a female terminal having a first end for mating with the male connector, and a second end opposite to the first end, the second end being provided with a plurality of differential signal pairs arranged at intervals and ground pins each located between any two adjacent pairs of the differential signal pairs, the differential signal pairs being connectable to the signal layer through the conductive pads, the ground pins being connectable to the ground layer through the conductive pads, and a high-frequency radiation area being formed in the vicinity of a joint between the differential signal pairs and the conductive pads when the first end is mated with the male connector; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area. ### Claim 13 (depends on 12) The connector combination according to claim 12, wherein: the PCB board is provided therein with copper deposition holes for connecting the signal layer and the ground layer to a surface of the PCB board; the conductive pads are connected to the signal layer and the ground layer through the copper deposition holes; and the high-frequency radiation area is formed in an area outside the copper deposition holes at the joint between the conductive pads and the differential signal pairs. ### Claim 14 (depends on 13) The connector combination according to claim 13, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 15 (depends on 12) The connector combination according to claim 12, wherein: each of the differential signal pairs comprises two differential signal pins; the wave-absorbing material is disposed on the differential signal pins and the ground pins, or the wave-absorbing material is disposed close to the differential signal pins and the ground pins; and the wave-absorbing material wraps at least an upper surface of each of the differential signal pins. ### Claim 16 (depends on 15) The connector combination according to claim 15, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 17 (depends on 12) The connector combination according to claim 12, wherein: each of the differential signal pairs comprises two differential signal pins; the wave-absorbing material is disposed on the differential signal pins and the ground pins, or the wave-absorbing material is disposed close to the differential signal pins and the ground pins; a height of the ground pins is greater than that of the differential signal pins; and the wave-absorbing material is an integral structure disposed on upper surfaces of the ground pins and spaced apart from the differential signal pins. ### Claim 18 (depends on 17) The connector combination according to claim 17, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins. ### Claim 19 (depends on 17) The connector combination according to claim 17, wherein: a surface of the wave-absorbing material is formed with first protrusions corresponding to the plurality of differential signal pairs, each of the first protrusions protruding between two adjacent pins of the ground pins and close to the differential signal pair; and a projection of the first protrusion toward the corresponding differential signal pair covers the two differential signal pins of the differential signal pair. ### Claim 20 (depends on 19) The connector combination according to claim 19, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins. ### Claim 21 A connector combination comprising a gold finger circuit board and a female connector, wherein: the gold finger circuit board comprises a gold finger insertion tip; the female connector is configured for being connected to a PCB board that is internally provided with a signal layer and a ground layer, the PCB board being provided on a surface thereof with conductive pads that are connected to the signal layer and the ground layer; and the female connector comprises: a female terminal having a first end for mating with the gold finger insertion tip, and a second end opposite to the first end, the second end being provided with a plurality of differential signal pairs arranged at intervals and ground pins each located between any two adjacent pairs of the differential signal pairs, the differential signal pairs being connectable to the signal layer through the conductive pads, the ground pins being connectable to the ground layer through the conductive pads, and a high-frequency radiation area being formed in the vicinity of a joint between the differential signal pairs and the conductive pads when the first end is mated with the gold finger insertion tip; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area. ### Claim 22 (depends on 21) The connector combination according to claim 21, wherein: the PCB board is provided therein with copper deposition holes for connecting the signal layer and the ground layer to a surface of the PCB board; the conductive pads are connected to the signal layer and the ground layer through the copper deposition holes; and the high-frequency radiation area is formed in an area outside the copper deposition holes at the joint between the conductive pads and the differential signal pairs. ### Claim 23 (depends on 21) The connector combination according to claim 21, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 24 (depends on 21) The connector combination according to claim 21, wherein: each of the differential signal pairs comprises two differential signal pins; the wave-absorbing material is disposed on the differential signal pins and the ground pins, or the wave-absorbing material is disposed close to the differential signal pins and the ground pins; and the wave-absorbing material wraps at least an upper surface of each of the differential signal pins. ### Claim 25 (depends on 24) The connector combination according to claim 24, wherein the wave-absorbing material wraps at least an upper surface of each of the ground pins. ### Claim 26 (depends on 21) The connector combination according to claim 21, wherein: each of the differential signal pairs comprises two differential signal pins; the wave-absorbing material is disposed on the differential signal pins and the ground pins, or the wave-absorbing material is disposed close to the differential signal pins and the ground pins; a height of the ground pins is greater than that of the differential signal pins; and the wave-absorbing material is an integral structure disposed on upper surfaces of the ground pins and spaced apart from the differential signal pins. ### Claim 27 (depends on 26) The connector combination according to claim 26, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins. ### Claim 28 (depends on 26) The connector combination according to claim 26, wherein: a surface of the wave-absorbing material is formed with first protrusions corresponding to the plurality of differential signal pairs, each of the first protrusions protruding between two adjacent pins of the ground pins and close to the differential signal pair; and a projection of the first protrusion toward the corresponding differential signal pair covers the two differential signal pins of the differential signal pair. ### Claim 29 (depends on 28) The connector combination according to claim 28, wherein a surface of the wave-absorbing material is formed with second protrusions corresponding to the ground pins, the second protrusions being connected to the corresponding ground pins.