# US 12,119,558 B2 · Integrated antenna module

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- Number: US 12,119,558 B2
- Document ID: US12119558B2
- Status: Granted
- Kind: B2
- Application number: 18/174,470
- Filed: 2023-02-24
- Published: 2024-01-18
- Granted: 2024-10-15
- Earliest claimed: 2019-10-17
- Assignees: QUALCOMM Incorporated
- Applicants: QUALCOMM Incorporated
- Inventors: Julio Zegarra; Peter Lien; Sang-June Park; Darryl Sheldon Jessie; Alberto Cicalini; Sean Oak; Neil Burns
- Web page: https://patentgrep.com/patent/US12119558B2

## CPC

- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them
- H01Q 1/48: Earthing means; Earth screens; Counterpoises
- H01Q 1/526: {Electromagnetic shields}
- H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

## Claims

### Claim 1

A method for manufacturing an antenna module, the method comprising:
attaching a first antenna to a first flexible printed circuit on a first end of the first flexible printed circuit, the first antenna being configured to transmit and receive signals in a millimeter wave length range;
attaching a wiring board to the first flexible printed circuit on a second end of the first flexible printed circuit opposite the first end of the first flexible printed circuit, the wiring board having a transceiver attached thereon;
attaching a second antenna to a second flexible printed circuit on a first end of the second flexible printed circuit, the second antenna being configured to transmit and receive signals in the millimeter wave length range; and
attaching the wiring board to the second flexible printed circuit on a second end of the second flexible printed circuit opposite the first end of the second flexible printed circuit,
wherein the second antenna is located on a first side of the wiring board and the first antenna is located on a second side of the wiring board different from the first side of the wiring board.

### Claim 2 (depends on 1)

The method of claim 1, further comprising:
attaching a third antenna to a third flexible printed circuit on a first end of the third flexible printed circuit, the third antenna being configured to transmit and receive signals in the millimeter wave length range; and
attaching the wiring board to the third flexible printed circuit on a second end of the third flexible printed circuit opposite the first end of the third flexible printed circuit,
wherein the third antenna is located on a third side of the wiring board different from the first side and second side of the wiring board.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first flexible printed circuit comprises a copper layer between a first shield layer and a second shield layer, and a ground layer on the second shield layer opposite the copper layer.

### Claim 4 (depends on 1)

The method of claim 1, wherein the wiring board is rigid and rectangular.

### Claim 5 (depends on 1)

The method of claim 1, further comprising attaching the first flexible printed circuit to the transceiver via routing on the wiring board.

### Claim 6 (depends on 1)

The method of claim 1, further comprising forming electromagnetic shielding on the first flexible printed circuit.

### Claim 7 (depends on 1)

The method of claim 1, further comprising:
disposing first radio frequency (RF) circuitry on the first end of the first flexible printed circuit, the first RF circuitry being coupled to the first antenna; and
disposing second RF circuitry on the first end of the second flexible printed circuit, the second RF circuitry being coupled to the second antenna.