# US 12,119,541 B2 · Package structure and antenna device using the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,119,541 B2
- Document ID: US12119541B2
- Status: Granted
- Kind: B2
- Application number: 17/848,508
- Filed: 2022-06-24
- Published: 2022-10-06
- Granted: 2024-10-15
- Earliest claimed: 2018-07-30
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: I-Yin Li; Tang-Chin Hung
- Web page: https://patentgrep.com/patent/US12119541B2

## CPC

- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 76/43: Gaseous fillings
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/248: {for antennas}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An antenna device is provided. The antenna device includes a first substrate and a second substrate facing the first substrate. The first substrate includes an inner surface and an outer surface opposite the inner surface of the first substrate. The second substrate includes an inner surface and an outer surface opposite the inner surface of the second substrate. The antenna device also includes a die disposed between the first substrate and the second substrate, a redistribution layer disposed between the die and the inner surface of the second substrate, and an antenna unit electrically connected to the die via the redistribution layer. The antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate, and the outer surface of the second substrate.

## Claims

### Claim 1

An antenna device, comprising:
a first substrate, wherein the first substrate comprises an inner surface and an outer surface opposite the inner surface of the first substrate;
a second substrate facing the first substrate, wherein the second substrate comprises an inner surface and an outer surface opposite the inner surface of the second substrate;
a first sealant and a plurality of spacers disposed between the first substrate and the second substrate;
a remaining space between the first substrate and the second substrate and inside the first sealant;
a die disposed between the first substrate and the second substrate, wherein a part of the remaining space is disposed between the die and the first substrate;
a redistribution layer disposed between the die and the inner surface of the second substrate;
an antenna unit electrically connected to the die via the redistribution layer; and
shielding layers disposed on an inner surface of the first substrate and an inner surface of the second substrate,
wherein the remaining space is vacant or filled with air or inert gases and the antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate, and the outer surface of the second substrate.

### Claim 2 (depends on 1)

The antenna device of claim 1, further comprising:
a second sealant,
wherein the first sealant is disposed between the second sealant and the die.

### Claim 3 (depends on 1)

The antenna device of claim 1, further comprising:
a wire;
wherein the second substrate comprises at least one via hole, and the wire passes through the via hole and is electrically connected the antenna unit and the redistribution layer.

### Claim 4 (depends on 1)

The antenna device of claim 1, further comprising:
a wire;
wherein the first substrate comprises at least one via hole, and the wire passes through the via hole and is electrically connected the antenna unit and the redistribution layer.

### Claim 5 (depends on 1)

The antenna device of claim 1, wherein a material of one of the first substrate and the second substrate comprises at least one of glass, polyimide, liquid-crystal polymer, polycarbonate, polypropylene, and polyethylene terephthalate.

### Claim 6

A package structure, comprising:
a first substrate;
a second substrate facing the first substrate;
a first sealant and a plurality of spacers disposed between the first substrate and the second substrate;
a remaining space between the first substrate and the second substrate and inside the first sealant;
a redistribution layer disposed in the remaining space;
a die disposed between the redistribution layer and the first substrate, wherein a part of the remaining space is disposed between the die and the first substrate;
a metal layer electrically connected to the redistribution layer; and
shielding layers disposed on an inner surface of the first substrate and an inner surface of the second substrate,
wherein the remaining space is vacant or filled with air or inert gases.

### Claim 7 (depends on 6)

The package structure of claim 6, further comprising:
a transmission line disposed between the first substrate and the second substrate;
wherein the transmission line is electrically connected to the die through the redistribution layer, and the transmission line is electrically connected to the metal layer.

### Claim 8 (depends on 7)

The package structure of claim 7, further comprising:
at least one via hole penetrating one of the first substrate and the second substrate;
wherein the transmission line passes through the at least one via hole to connect to the metal layer.

### Claim 9 (depends on 6)

The package structure of claim 6, further comprising:
at least one bonding element disposed between the first substrate and the second substrate.

### Claim 10 (depends on 6)

The package structure of claim 6, wherein the metal layer is disposed on an inner surface of one of the first substrate and the second substrate or on an outer surface of one of the first substrate and the second substrate.

### Claim 11 (depends on 6)

The package structure of claim 6, wherein the metal layer is an antenna unit.

### Claim 12 (depends on 6)

The package structure of claim 6, wherein a material of one of the first substrate and the second substrate comprises at least one of glass, polyimide, liquid-crystal polymer, polycarbonate, polypropylene, and polyethylene terephthalate.

### Claim 13 (depends on 6)

The package structure of claim 6, further comprising:
a potting compound layer disposed outside the sealant.