# US 12,119,539 B2 · Antenna module and communication device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,539 B2 - Document ID: US12119539B2 - Status: Granted - Kind: B2 - Application number: 17/702,799 - Filed: 2022-03-24 - Published: 2022-07-07 - Granted: 2024-10-15 - Earliest claimed: 2019-09-27 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Naoki Gouchi; Kengo Onaka - Web page: https://patentgrep.com/patent/US12119539B2 ## CPC - H01Q 1/2208: {associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems (methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00)} - H01Q 1/243: {with built-in antennas} - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H01Q 1/20: Resilient mountings - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H05K 1/02: Details - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An antenna module includes an antenna substrate including a feed element, and a radio frequency integrated circuit (RFIC) mounted on a lower surface of the antenna substrate. The antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward from the mount portion. The feed element is disposed in the mount portion and the overhang portion. The antenna module further includes a heat dissipator disposed on the lower surface of the overhang portion. ## Claims ### Claim 1 An antenna module, comprising: an antenna substrate including a first surface, a second surface opposite to the first surface, and an antenna element; a radio-frequency integrated circuit (RFIC) mounted on the second surface of the antenna substrate and connected to the antenna element; and a heat dissipator comprising a thermally conductive material, wherein the antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward and away from the mount portion, wherein at least part of the antenna element is disposed in the overhang portion of the antenna substrate either on the first surface of the antenna substrate or within the antenna substrate between the first surface and the second surface of the antenna substrate, wherein the heat dissipator is disposed on the second surface of the antenna substrate in the overhang portion, wherein the overhang portion includes a first overhang portion that extends in a first direction, and a second overhang portion that extends in a second direction different from the first direction, wherein the antenna element includes a first antenna element disposed in the first overhang portion, and a second antenna element disposed in the second overhang portion, and wherein the heat dissipator includes a first heat dissipator disposed on the second surface of the antenna substrate in the first overhang portion, and a second heat dissipator disposed on the second surface of the antenna substrate in the second overhang portion. ### Claim 2 (depends on 1) The antenna module according to claim 1, wherein the antenna element is a planar element that extends in a direction along the first surface of the antenna substrate, and wherein the antenna substrate further includes a planar ground electrode disposed between the antenna element and the second surface of the antenna substrate. ### Claim 3 (depends on 2) The antenna module according to claim 2, wherein the antenna substrate further includes an electrically conductive member that connects the ground electrode and the heat dissipator to each other. ### Claim 4 (depends on 3) The antenna module according to claim 3, wherein the heat dissipator includes an electrically conductive material, and wherein the ground electrode includes a grounded portion that is grounded through the electrically conductive member and the heat dissipator, and a feeder connected to the RFIC. ### Claim 5 (depends on 1) The antenna module according to claim 1, wherein the heat dissipator includes an electrically conductive material, wherein the antenna substrate further includes an electrically conductive member that connects the antenna element and the heat dissipator to each other, and wherein the antenna element includes a grounded portion grounded through the electrically conductive member and the heat dissipator, and a feeder connected to the RFIC. ### Claim 6 A communication device, comprising: an antenna module; and a mount substrate disposed across from the-an antenna substrate with a radio-frequency integrated circuit (RFIC) interposed therebetween, and on which the RFIC is mounted, wherein the antenna module including the antenna substrate including a first surface, a second surface opposite to the first surface, and an antenna element, the RFIC mounted on the second surface of the antenna substrate and connected to the antenna element, and a heat dissipator comprising a thermally conductive material, wherein the antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward and away from the mount portion, wherein at least part of the antenna element is disposed in the overhang portion of the antenna substrate either on the first surface of the antenna substrate or within the antenna substrate between the first surface and the second surface of the antenna substrate, wherein the heat dissipator is disposed on the second surface of the antenna substrate in the overhang portion, wherein the overhang portion includes a first overhang portion that extends in a first direction, and a second overhang portion that extends in a second direction different from the first direction, wherein the antenna element includes a first antenna element disposed in the first overhang portion. and a second antenna element disposed in the second overhang portion, and wherein the heat dissipator includes a first heat dissipator disposed on the second surface of the antenna substrate in the first overhang portion, and a second heat dissipator disposed on the second surface of the antenna substrate in the second overhang portion. ### Claim 7 (depends on 6) The communication device according to claim 6, wherein the antenna element is a planar element that extends in a direction along the first surface, and the antenna substrate further includes a planar ground electrode disposed between the antenna element and the second surface. ### Claim 8 (depends on 7) The communication device according to claim 7, wherein the antenna substrate further includes an electrically conductive member that connects the ground electrode and the heat dissipator to each other. ### Claim 9 (depends on 8) The communication device according to claim 8, wherein the heat dissipator includes an electrically conductive material, and the ground electrode includes a grounded portion that is grounded through the electrically conductive member and the heat dissipator, and a feeder connected to the RFIC. ### Claim 10 (depends on 6) The communication device according to claim 6, further comprising: a contact member disposed between the heat dissipator and the mount substrate and in contact with the heat dissipator and the mount substrate. ### Claim 11 (depends on 10) The communication device according to claim 10, further comprising: a housing that accommodates the antenna module and the mount substrate, wherein the heat dissipator is in contact with the housing. ### Claim 12 (depends on 6) The communication device according to claim 6, further comprising: a housing that accommodates the antenna module and the mount substrate, wherein the heat dissipator is in contact with the housing. ### Claim 13 An antenna module, comprising: an antenna substrate including a first surface, a second surface opposite to the first surface, and an antenna element; and a radio frequency integrated circuit (RFIC) mounted on the second surface of the antenna substrate and connected to the antenna element, wherein the antenna substrate includes a mount portion on which the RFIC is mounted, and an overhang portion that extends outward and away from the mount portion, at least part of the antenna element is disposed in the overhang portion of the antenna substrate either on the first surface of the antenna substrate or within the antenna substrate between the first surface and the second surface of the antenna substrate, the mount portion of the antenna substrate includes a rigid substrate and a flexible substrate laminated one on top of another, the overhang portion of the antenna substrate is formed from the flexible substrate without the rigid substrate, and the antenna module further comprises a heat dissipator that is in contact with the overhang portion, the heat dissipator comprising a thermally conductive material. ### Claim 14 (depends on 13) The antenna module according to claim 13, wherein the overhang portion of the antenna substrate includes a first portion in which the antenna element is disposed, a second portion that is in contact with the heat dissipator, and a bend that is disposed between the first portion and the second portion. ### Claim 15 (depends on 14) The antenna module according to claim 14, wherein the heat dissipator comprises a housing that covers the antenna module. ### Claim 16 (depends on 13) The antenna module according to claim 13, wherein the overhang portion includes a first overhang portion that extends in a first direction, and a second overhang portion that extends in a second direction different from the first direction, wherein the antenna element includes a first antenna element disposed in the first overhang portion, and a second antenna element disposed in the second overhang portion, and wherein the heat dissipator includes a first heat dissipator disposed on the second surface of the antenna substrate in the first overhang portion, and a second heat dissipator disposed on the second surface of the antenna substrate in the second overhang portion.