# US 12,119,531 B2 · Signal transmission line comprising stacked insulating layers having a signal line and a ground conductor respectively spaced apart by a spacer with a hollow portion > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,531 B2 - Document ID: US12119531B2 - Status: Granted - Kind: B2 - Application number: 17/691,495 - Filed: 2022-03-10 - Published: 2022-06-23 - Granted: 2024-10-15 - Earliest claimed: 2019-11-15 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Nobuo Ikemoto - Web page: https://patentgrep.com/patent/US12119531B2 ## CPC - H01P 3/082: {Multilayer dielectric} - H01P 3/087: {Suspended triplate lines} - H01P 3/08: Microstrips; Strip lines - H01P 3/088: {Stacked transmission lines} - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 2201/09845: Stepped hole, via, edge, bump or conductor - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A transmission line includes a first structure including a first insulating substrate and a ground conductor on the first insulating substrate, a second structure including a second insulating substrate and a signal line, ground conductors, and interlayer connection conductors on or in the second insulating substrate, a third insulating substrate including openings, and metal bonding materials that bond the structure and the structure to each other with the third insulating substrate interposed therebetween. The first and second insulating substrates are stacked with the third insulating substrate interposed therebetween to define hollow portions. The signal line and the ground conductor partially face each other across the hollow portions in a bonding direction. The ground conductor includes openings in regions that overlap the signal line but do not overlap the hollow portions when looking in plan view in the bonding direction. ## Claims ### Claim 1 A transmission line comprising: a first structure including a first insulating substrate and a first ground conductor on or in the first insulating substrate; a second structure including a second insulating substrate and a signal line, and an interlayer connection conductor on or in the second insulating substrate; and a spacer including a third insulating substrate including an opening; wherein the first insulating substrate and the second insulating substrate are stacked with the third insulating substrate interposed therebetween to define at least one hollow portion; the signal line and the first ground conductor partially face each other across the at least one hollow portion in a bonding direction; the first ground conductor includes at least one opening in a region that overlaps the signal line but does not overlap the at least one hollow portion when looking in plan view in the bonding direction; and the second structure includes a second ground conductor. ### Claim 2 (depends on 1) The transmission line according to claim 1, wherein the at least one hollow portion includes a plurality of hollow portions and the at least one opening includes a plurality of the openings provided in the first ground conductor; the plurality of hollow portions are periodically disposed along an extension direction of the signal line; and the plurality of openings in the first ground conductor are also periodically disposed along the extension direction of the signal line. ### Claim 3 (depends on 1) The transmission line according to claim 1, wherein an auxiliary ground conductor is provided at a surface layer side of the transmission line so as to cover the opening in the first ground conductor. ### Claim 4 (depends on 1) The transmission line according to claim 1, wherein the signal line and the first ground conductor face each other across the at least one hollow portion and the second insulating substrate. ### Claim 5 (depends on 1) The transmission line according to claim 1, wherein the transmission line includes a portion where a thickness of the second insulating substrate is smaller at a position where the signal line faces the first ground conductor. ### Claim 6 (depends on 1) The transmission line according to claim 1, wherein the at least one hollow portion and the at least one opening in the first ground conductor extend diagonally with respect to an extension direction of the signal line. ### Claim 7 (depends on 1) The transmission line according to claim 1, wherein the transmission line includes a bent portion; the at least one opening includes a plurality of openings provided in the first ground conductor; and among the plurality of openings in the first ground conductor, openings in the bent portion are larger than openings in other portions. ### Claim 8 (depends on 1) The transmission line according to claim 1, wherein the transmission line includes a bent portion; and the first ground conductor does not have an opening in the bent portion. ### Claim 9 (depends on 1) The transmission line according to claim 1, further comprising a metal bonding material that bonds the first structure and the second structure to each other with the spacer interposed therebetween. ### Claim 10 An electronic device comprising: a circuit board; and a transmission line connected to the circuit board; wherein the transmission line includes: a first structure including a first insulating substrate and a first ground conductor on or in the first insulating substrate; a second structure including a second insulating substrate and a signal line, a second ground conductor, and an interlayer connection conductor on or in the second insulating substrate; a spacer including a third insulating substrate including an opening; and a metal bonding material that bonds the first structure and the second structure to each other with the spacer interposed therebetween; the first insulating substrate and the second insulating substrate are stacked with the third insulating substrate interposed therebetween to provide at least one hollow portion; the signal line and the first ground conductor partially face each other across the at least one hollow portion in a bonding direction; and the first ground conductor includes at least one opening in a region that overlaps the signal line but does not overlap the at least one hollow portion when looking in plan view in the bonding direction. ### Claim 11 (depends on 10) The electronic device according to claim 10, wherein the at least one hollow portion includes a plurality of hollow portions and the at least one opening includes a plurality of openings provided in the first ground conductor; the plurality of hollow portions are periodically disposed along an extension direction of the signal line; and the plurality of openings in the first ground conductor are also periodically disposed along the extension direction of the signal line. ### Claim 12 (depends on 11) The electronic device according to claim 11, wherein the plurality of the hollow portions are provided in a first portion of the transmission line and not in a second portion of the transmission line. ### Claim 13 (depends on 12) The electronic device according to claim 12, wherein the plurality of openings in the first ground conductor are located in the second region portion of the transmission line. ### Claim 14 (depends on 10) The electronic device according to claim 10, wherein the signal line and the first ground conductor face each other across the at least one hollow portion and the second insulating substrate. ### Claim 15 (depends on 10) The electronic device according to claim 10, wherein the transmission line includes a portion where a thickness of the second insulating substrate is smaller at a position where the signal line faces the first ground conductor. ### Claim 16 (depends on 10) The electronic device according to claim 10, wherein the at least one hollow portion and the at least one opening in the first ground conductor extend diagonally with respect to an extension direction of the signal line. ### Claim 17 (depends on 10) The electronic device according to claim 10, wherein the transmission line includes a bent portion; the at least one opening includes a plurality of openings provided in the first ground conductor; and among the plurality of openings in the first ground conductor, openings in the bent portion are larger than openings in other portions. ### Claim 18 (depends on 10) The electronic device according to claim 10, wherein the transmission line includes a bent portion; and the first ground conductor does not have an opening in the bent portion. ### Claim 19 (depends on 10) The electronic device according to claim 10, wherein an auxiliary ground conductor is provided at a surface layer side of the transmission line so as to cover the at least one opening in the first ground conductor.