# US 12,119,438 B2 · Thermal management system for electrically-powered devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,438 B2 - Document ID: US12119438B2 - Status: Granted - Kind: B2 - Application number: 18/269,128 - Filed: 2021-12-23 - Published: 2024-03-14 - Granted: 2024-10-15 - Earliest claimed: 2020-12-23 - Applicants: Joseph L. Pikulski; Willett Tuitele - Inventors: Joseph L. Pikulski; Willett Tuitele - Web page: https://patentgrep.com/patent/US12119438B2 ## CPC - H10H 20/8586: {comprising fluids, e.g. heat-pipes} - F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) - F21V 29/59: {with forced flow of the coolant} - F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/0365: {of means for heat extraction or cooling} - H10H 20/8506: {Containers} - H10W 40/475: {using jet impingement (H10W40/776 takes precedence)} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after if has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device. ## Claims ### Claim 1 A thermal management system, comprising: a base thermal management fixture in fluid communication with a cooling fluid source, said base thermal management fixture configured to receive and hold at least one electrically-powered device, said base thermal management fixture comprising a fluid-input opening configured to receive cooling fluid from said cooling fluid source; wherein said base thermal management fixture comprises internal components configured to direct said cooling fluid toward said electrically-powered device, said internal components comprising an impingement head configured to direct said cooling fluid toward said electrically-powered device, such that said cooling fluid can directly impinge on said at least one electrically-powered device, absorb heat from said at least one electrically-powered device, and become heated waste fluid; wherein said base thermal management fixture comprises an exit port configured such that said heated waste fluid can exit from said exit port and can be removed from said base thermal management fixture and said thermal management system. ### Claim 2 (depends on 1) The thermal management system of claim 1, wherein said cooling fluid comprises a liquid. ### Claim 3 (depends on 1) The thermal management system of claim 1, further comprising a channelizer fixture connected to said impingement head. ### Claim 4 (depends on 3) The thermal management system of claim 3, wherein said channelizer fixture comprises a curved surface. ### Claim 5 (depends on 4) The thermal management system of claim 4, wherein said base thermal management fixture further comprises curved channel-forming features configured to form a complementary surface to said curved surface of said channelizer fixture. ### Claim 6 (depends on 1) The thermal management system of claim 1, wherein said base thermal management fixture comprises a holding assembly portion, said at least one electrically-powered device in said holding assembly portion, said holding assembly portion defining an aperture through which said cooling fluid can pass to directly impinge on said at least one electrically-powered device. ### Claim 7 (depends on 1) The thermal management system of claim 1, wherein said at least one electrically-powered device is in a targeted area of said base thermal management fixture. ### Claim 8 (depends on 1) The thermal management system of claim 1, further comprising said at least one electrically-powered device. ### Claim 9 (depends on 8) The thermal management system of claim 8, wherein said at least one electrically-powered device is at least one microprocessor. ### Claim 10 (depends on 8) The thermal management system of claim 8, wherein said at least one electrically-powered device is at least one microprocessor chip. ### Claim 11 A base thermal management fixture for use in a thermal management system, comprising: a holding assembly portion defining an aperture and configured to receive at least one electrically-powered device; an input opening configured to receive cooling fluid from a cooling fluid source; an impingement head configured to direct said cooling fluid through said aperture, such that said cooling fluid can absorb heat from said at least one electrically-powered device and become heated waste fluid; an exit port configured such that said heated waste fluid can exit from said exit port and can be removed from said base thermal management fixture. ### Claim 12 (depends on 11) The base thermal management fixture of claim 11, wherein said impingement head comprises one or more apertures surrounded by raised walls. ### Claim 13 (depends on 11) The base thermal management fixture of claim 11, further comprising said at least one electrically-powered device and a protective surface on said at least one electrically-powered device, wherein said base thermal management fixture is configured such that said cooling fluid can absorb heat directly from said protective surface. ### Claim 14 (depends on 13) The base thermal management fixture of claim 13, wherein said at least one electrically-powered device comprises at least one microprocessor. ### Claim 15 (depends on 13) The base thermal management fixture of claim 13, wherein said protective surface comprises an anti-erosion material. ### Claim 16 (depends on 11) The base thermal management fixture of claim 11, further comprising said at least one electrically-powered device, wherein said at least one electrically-powered device comprises at least one microprocessor, and wherein said base thermal management fixture is configured such that said cooling fluid can absorb heat directly from said at least one microprocessor. ### Claim 17 A method of thermally-regulating a plurality of electrically-powered devices, comprising: providing a cooling fluid source; flowing cooling fluid from said cooling fluid source through a first base thermal management fixture in fluid communication with said cooling fluid source, said first base thermal management fixture holding at least a first electrically-powered device; wherein said first base thermal management fixture comprises internal features configured to direct said cooling fluid toward said first electrically-powered device, such that said cooling fluid absorbs heat directly from said first electrically-powered device and becomes a first heated waste fluid; wherein said first base thermal management fixture is configured such that said first heated waste fluid exits from said first base thermal management fixture and is removed from said thermal management system; and flowing said cooling fluid from said first base thermal management fixture to a second base thermal management fixture in fluid communication with said first base thermal management fixture, said cooling fluid from said first base thermal management fixture not comprising said first heated waste fluid, said second base thermal management fixture holding at least a second electrically-powered device; wherein said second base thermal management fixture comprises internal features configured to direct said cooling fluid received from said first base thermal management fixture toward said second electrically-powered device. ### Claim 18 (depends on 17) The method of claim 17, wherein said internal components comprise an impingement head. ### Claim 19 (depends on 17) The method of claim 17, wherein said second base thermal management fixture is configured such that said cooling fluid received from said first base thermal management fixture absorbs heat directly from said second electrically-powered device and becomes a second heated waste fluid that exits from said second base thermal management fixture and is removed from said thermal management system. ### Claim 20 (depends on 17) The method of claim 17, wherein said cooling fluid is liquid.