# US 12,119,422 B2 · Systems and methods for encapsulating an electronic component

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- Number: US 12,119,422 B2
- Document ID: US12119422B2
- Status: Granted
- Kind: B2
- Application number: 17/593,073
- Filed: 2020-03-06
- Published: 2022-06-09
- Granted: 2024-10-15
- Earliest claimed: 2019-03-08
- Assignees: H.B. Fuller Company
- Applicants: H.B. Fuller Company
- Inventors: Peter Remmers; Volker K. Kestler; Thomas F. Kauffman
- Web page: https://patentgrep.com/patent/US12119422B2

## CPC

- H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F 19/804: {Materials of encapsulations}
- H10P 72/0441: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like}
- B32B 37/003: {to avoid air inclusion}
- B32B 37/24: with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate (B32B37/15 takes precedence)
- B32B 2037/243: {Coating}
- B32B 2457/12: Photovoltaic modules
- Y02E 10/50: Photovoltaic [PV] energy
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

## Claims

### Claim 1

A method of encapsulating an electronic component, the method comprising:
applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate,
the applicator roll comprising an outer surface and being spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component, the gap controlling the thickness of the first layer of encapsulating composition,
the first layer of encapsulating composition encapsulating the electronic component on the substrate, and
an interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

### Claim 2 (depends on 1)

The method of claim 1, wherein applying the first layer includes passing the substrate past the applicator roll and turning the applicator roll in the same direction as a direction of travel of the substrate.

### Claim 3 (depends on 2)

The method of claim 2, wherein a tangential speed of the applicator roll is greater or less than a linear speed of the substrate.

### Claim 4 (depends on 1)

The method of claim 1, wherein applying the first layer includes passing the substrate past the applicator roll in a first direction and turning the applicator roll in a direction opposite the first direction.

### Claim 5 (depends on 1)

The method of claim 1, wherein the encapsulating composition is at a temperature of from about 120° ° C. to about 170° C. prior to contact with the electronic component.

### Claim 6 (depends on 1)

The method of claim 1, wherein the encapsulating composition is at least one of polypropylene, ethylene vinyl acetate, and an amorphous poly alpha olefin.

### Claim 7 (depends on 1)

The method of claim 1, wherein the encapsulating composition is applied as a liquid.

### Claim 8

A method of encapsulating an electronic component on a surface of a substrate, the method comprising:
applying a first layer of an encapsulation composition onto a substrate from an applicator roll, the applicator roll comprising an outer surface and being spaced apart from the substrate such that a gap exists between the applicator roll and the substrate, the gap controlling the thickness of the first layer of encapsulation composition,
positioning an electronic component on the first layer of encapsulation composition; and
applying a second layer of encapsulation composition onto the electronic component from the applicator roll, such that the electronic component is encapsulated within the encapsulating composition and the encapsulating composition is substantially free of voids.

### Claim 9 (depends on 8)

The method of claim 8, wherein applying the second layer of encapsulating composition includes controlling the size of a gap defined between an outer surface of the applicator roll and the surface of the substrate, such that the applicator roll does not contact the electronic component.

### Claim 10 (depends on 8)

The method of claim 8, wherein applying the first layer of encapsulating composition includes passing the substrate past the applicator roll in a first direction and turning the applicator roll in the same direction as the first direction.

### Claim 11 (depends on 10)

The method of claim 10, wherein a tangential speed of the applicator roll is greater or less than a linear speed of the substrate.

### Claim 12 (depends on 8)

The method of claim 8, wherein applying the first layer of encapsulating composition includes passing the substrate past the applicator roll in a first direction and turning the applicator roll in a direction opposite the first direction.

### Claim 13 (depends on 8)

The method of claim 8, wherein the encapsulating composition is at a temperature of from about 120° C. to about 170° C. prior to contact with the electronic component.

### Claim 14 (depends on 8)

The method of claim 8, wherein the encapsulating composition is applied as a liquid.