# US 12,119,371 B2 · Light source apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,371 B2 - Document ID: US12119371B2 - Status: Granted - Kind: B2 - Application number: 17/754,825 - Filed: 2020-10-22 - Published: 2024-03-28 - Granted: 2024-10-15 - Earliest claimed: 2019-10-23 - Assignees: Sony Semiconductor Solutions Corporation; Sony Group Corporation - Applicants: Sony Group Corporation; Sony Semiconductor Solutions Corporation - Inventors: Hiizu Ohtorii; Hiroshi Morita; Yusuke Oyama; Eiji Otani; Ken Kikuchi - Web page: https://patentgrep.com/patent/US12119371B2 ## CPC - H05K 1/02: Details - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - G01S 7/4813: {Housing arrangements} - G01S 7/4814: {of transmitters alone} - G01S 7/4815: {using multiple transmitters} - G01S 7/484: Transmitters - G01S 17/42: Simultaneous measurement of distance and other co-ordinates (indirect measurement G01S17/46) - G01S 17/89: for mapping or imaging - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/0281: {Reinforcement details thereof} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H10F 55/00: Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/858: Means for heat extraction or cooling - G01S 7/4816: {of receivers alone} - H01S 5/02253: using lenses - H01S 5/0234: Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings - H01S 5/0237: by soldering - H01S 5/0239: Combinations of electrical or optical elements - H01S 5/423: {having a vertical cavity} - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H10W 90/00: Package configurations - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light. ## Claims ### Claim 1 A light source apparatus comprising: a transmissive board that transmits light emitted by a light-emitting element; a circuit board that drives the light-emitting element and is joined to the transmissive board; and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump, wherein the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via a second bump. ### Claim 2 (depends on 1) The light source apparatus according to claim 1, further comprising: the organic board. ### Claim 3 (depends on 2) The light source apparatus according to claim 2, wherein the light-emitting board has one or a plurality of light-emitting points. ### Claim 4 (depends on 2) The light source apparatus according to claim 2, wherein the circuit board has an opening at a portion corresponding to the light-emitting element. ### Claim 5 (depends on 4) The light source apparatus according to claim 4, further comprising: a lens through which light emitted by the light-emitting element passes, wherein an optical axis of the lens, an optical axis of the light-emitting element, and a central axis of the opening are arranged approximately coaxially. ### Claim 6 (depends on 5) The light source apparatus according to claim 5, wherein the lens is provided on one of or both a light-emitting-board side of the transmissive board on which side the light-emitting board is provided and a side opposite to the light-emitting-board side. ### Claim 7 (depends on 6) The light source apparatus according to claim 6, wherein the lens is provided on the light-emitting-board side of the transmissive board such that a space is formed between the light-emitting element and the lens. ### Claim 8 (depends on 7) The light source apparatus according to claim 7, wherein the lens is provided for each light-emitting point of the light-emitting board. ### Claim 9 (depends on 5) The light source apparatus according to claim 5, comprising: a plurality of lenses through which light emitted by the light-emitting element passes. ### Claim 10 (depends on 9) The light source apparatus according to claim 9, wherein one lens and another lens of the plurality of lenses are configured such that collimated light couples the one lens and the other lens. ### Claim 11 (depends on 2) The light source apparatus according to claim 2, further comprising: a heat dissipating body formed between the light-emitting board and the organic board. ### Claim 12 (depends on 11) The light source apparatus according to claim 11, wherein the heat dissipating body is solder having a melting point lower than melting points of the first bump and the second bump. ### Claim 13 (depends on 2) The light source apparatus according to claim 2, wherein the second bump has therein a core body. ### Claim 14 (depends on 2) The light source apparatus according to claim 2, wherein a filler material seals a space between the circuit board and the organic board. ### Claim 15 (depends on 2) The light source apparatus according to claim 2, wherein the organic board is formed in a ladder shape, a zigzag shape, or a swirl shape. ### Claim 16 (depends on 2) The light source apparatus according to claim 2, further comprising: a reinforcing material that supports the organic board. ### Claim 17 (depends on 2) The light source apparatus according to claim 2, further comprising: a base member to which the organic board is attached. ### Claim 18 (depends on 17) The light source apparatus according to claim 17, wherein the base member has a curved surface having steps formed thereon, and the organic board is attached to the curved surface. ### Claim 19 (depends on 17) The light source apparatus according to claim 17, further comprising: a cooling mechanism. ### Claim 20 (depends on 2) The light source apparatus according to claim 2, wherein a light source chip including the transmissive board, the circuit board, and the light-emitting board is arranged around a light-receiving element. ### Claim 21 (depends on 20) The light source apparatus according to claim 20, wherein the light source chip and the light-receiving element are arranged on one board. ### Claim 22 (depends on 2) The light source apparatus according to claim 2, wherein a plurality of light source chips each including the transmissive board, the circuit board, and the light-emitting board is arranged on the organic board, and simultaneous emission of adjacent light source chips is limited. ### Claim 23 (depends on 2) The light source apparatus according to claim 2, further comprising: a capacitor that connects an electric power supply line and a GND line of a light source chip including the transmissive board, the circuit board, and the light-emitting board.