# US 12,119,370 B2 · Micro LED display including antistatic ground circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,370 B2 - Document ID: US12119370B2 - Status: Granted - Kind: B2 - Application number: 17/535,800 - Filed: 2021-11-26 - Published: 2022-03-17 - Granted: 2024-10-15 - Earliest claimed: 2019-05-31 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Seongho Son; Jongsung Lee; Changjoon Lee - Web page: https://patentgrep.com/patent/US12119370B2 ## CPC - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H05K 9/0054: {specially adapted for display applications} - H05K 9/0067: {Devices for protecting against damage from electrostatic discharge} - H10D 89/60: Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] - H10D 89/921: {characterised by the configuration of the interconnections connecting the protective arrangements, e.g. ESD buses} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/30: Active-matrix LED displays - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract An antistatic ground circuit board and a micro light emitting diode (LED) display including same are provided. The display includes a substrate comprising a first surface oriented toward a first direction, a second surface oriented toward a second direction opposite the first direction, and a side surface oriented toward a third direction perpendicular to the first and second directions, a first circuit unit disposed on the first surface, a second circuit unit disposed on the second surface, a side circuit unit disposed on the side surface and electrically connected to the first circuit unit, a plurality of micro LED chips arranged on one surface of the first circuit unit oriented toward the first direction, and a ground circuit board disposed on the second surface to ground static electricity generated in one or more circuit units from among the first circuit unit, the second circuit unit, and the side circuit unit. ## Claims ### Claim 1 A micro light emitting diode (LED) display comprising: a substrate comprising: a first face disposed to face in a first direction, a second face disposed to face in a second direction opposite to the first direction, and a side face disposed to face in a third direction perpendicular to the first direction and the second direction; a first circuit disposed on the first face; a second circuit disposed on the second face; a side circuit disposed on the side face and electrically connected in parallel to the first circuit; multiple micro LED chips arranged on a face of the first circuit facing in the first direction; and a ground circuit board disposed on the second face and configured to ground static electricity having been generated in one or more circuits from among the first circuit, the second circuit, or the side circuit, wherein the ground circuit board is disposed between the second circuit and the side circuit, wherein the ground circuit board comprises: a signal layer electrically coupled to the side circuit, and a ground layer attached to a first face of the signal layer, and wherein the ground layer is electrically connected, through the signal layer, to at least one antistatic protection element arranged on a second face of the signal layer opposite to the first face of the signal layer. ### Claim 2 (depends on 1) The micro LED display of claim 1, wherein the ground circuit board is disposed between the side circuit and the second circuit. ### Claim 3 (depends on 1) The micro LED display of claim 1, wherein the ground circuit board comprises a flexible material. ### Claim 4 (depends on 1) The micro LED display of claim 1, wherein the at least one antistatic protection element comprises a first connection pad and a second connection pad, wherein the first connection pad is electrically connected to the signal layer, and wherein the second connection pad is electrically connected to the ground layer. ### Claim 5 (depends on 4) The micro LED display of claim 4, wherein the ground layer comprises a ground connection pad, and wherein the second connection pad is electrically connected to the ground connection pad. ### Claim 6 (depends on 5) The micro LED display of claim 5, wherein a portion of the ground layer on which the ground connection pad is disposed has an isosceles trapezoid shape. ### Claim 7 (depends on 1) The micro LED display of claim 1, wherein the at least one antistatic protection element comprises a transient voltage suppressor (TVS) diode. ### Claim 8 (depends on 1) The micro LED display of claim 1, wherein the signal layer comprises a flexible material. ### Claim 9 (depends on 1) The micro LED display of claim 1, wherein the ground layer comprises a flexible material. ### Claim 10 (depends on 1) The micro LED display of claim 1, wherein the at least one antistatic protection element is mounted on the signal layer by using a film on glass (FOG) method. ### Claim 11 (depends on 1) The micro LED display of claim 1, wherein the signal layer on which the at least one antistatic protection element is arranged in an isosceles trapezoid shape. ### Claim 12 (depends on 1) The micro LED display of claim 1, wherein the substrate comprises a glass material. ### Claim 13 (depends on 1) The micro LED display of claim 1, wherein the second circuit is formed by a conductive material patterned onto the second face of the substrate or is a flexible circuit board connected to the second face. ### Claim 14 (depends on 1) The micro LED display of claim 1, wherein the first circuit comprises a multiplexer/demultiplexer (MUX/DEMUX) circuit, wherein the second circuit comprises a driver integrated circuit (IC), and wherein the ground circuit board is disposed on an intermediate path between the MUX/DEMUX circuit and the driver IC.