# US 12,119,361 B2 · Circuit board assembly with photosensitive element mounted to back side of circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,361 B2 - Document ID: US12119361B2 - Status: Granted - Kind: B2 - Application number: 18/207,357 - Filed: 2023-06-08 - Published: 2023-10-05 - Granted: 2024-10-15 - Earliest claimed: 2017-05-18 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Mingzhu Wang; Nan Guo; Zhenyu Chen; Takehiko Tanaka; Jingfei He; Zhen Huang; Zhongyu Luan; Feifan Chen - Web page: https://patentgrep.com/patent/US12119361B2 ## CPC - H10F 39/804: {Containers or encapsulations} - H04M 1/0264: {for a camera module assembly} - H04N 23/51: Housings - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/181: associated with surface mounted components - H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10F 39/8063: {Microlenses} - H05K 2201/10121: Optical component, e.g. opto-electronic component - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate. ## Claims ### Claim 1 A camera module, comprising: a circuit board, including at least one substrate, wherein the substrate has a substrate front surface, a substrate back surface, and at least one substrate channel, wherein the substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface; at least one photosensitive element, having a photosensitive area and a non-photosensitive area surrounding the photosensitive area, wherein a first part of the non-photosensitive area is mounted on the back surface substrate of the substrate, and the photosensitive element and the substrate are conductively connected, and the photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel; at least one optical lens, being held in a photosensitive path of the photosensitive element; and at least one filter element, being directly mounted on the substrate front surface of the substrate. ### Claim 2 (depends on 1) The camera module according to claim 1, wherein a sealed space is formed by the substrate, the photosensitive element, and the filter element at a position corresponding to the substrate channel of the substrate, and the photosensitive area and the second part of the non-photosensitive area of the photosensitive element are held in the sealed space. ### Claim 3 (depends on 1) The camera module according to claim 1, further comprising a buffer portion arranged between the filter element and the substrate front surface of the substrate, and the buffer portion is configured to attach the filter element on the substrate front surface. ### Claim 4 (depends on 3) The camera module according to claim 3, wherein the buffer portion is overlapping with the non-photosensitive area in an optical axis direction. ### Claim 5 (depends on 3) The camera module according to claim 3, wherein the buffer portion is in the shape of a frame. ### Claim 6 (depends on 3) The camera module according to claim 3, wherein the buffer portion is elastic. ### Claim 7 (depends on 3) The camera module according to claim 3, further comprising at least one molded base having at least one light window, wherein the molded base is integrally bonded to at least a portion of the substrate front surface of the substrate, so that the molded base surrounds the photosensitive area of the photosensitive element, and the photosensitive area and the second part of the non-photosensitive area correspond to the light window of the molded base. ### Claim 8 (depends on 7) The camera module according to claim 7, wherein molded base embeds an outer edge of the filter element, so that the molded base, the filter element, the substrate, and the photosensitive element are integrally bonded. ### Claim 9 (depends on 8) The camera module according to claim 8, the buffer portion is held between the molded base and the substrate front surface of the substrate. ### Claim 10 (depends on 8) The camera module according to claim 8, further comprising at least one electronic component, wherein the electronic component is conductively connected to the substrate. ### Claim 11 (depends on 10) The camera module according to claim 10, wherein the electronic component is conductively connected to the substrate on the substrate front surface of the substrate, and the electronic component protrudes from the substrate front surface, and the molded base embeds at least a part of the electronic component protruding from the substrate front surface. ### Claim 12 (depends on 11) The camera module according to claim 11, wherein the buffer portion is overlapping with the electronic component and at least a portion of the filter element in an optical axis direction. ### Claim 13 (depends on 11) The camera module according to claim 11, wherein in an optical axis direction, at least a part of the electronic component located on the substrate front surface overlaps with the non-photosensitive area of the photosensitive element. ### Claim 14 (depends on 11) The camera module according to claim 11, further comprising a plurality of electronic components, wherein at least one of the electronic components is conductively connected to the substrate on the substrate back surface of the substrate, and protrudes from the substrate back surface. ### Claim 15 (depends on 14) The camera module according to claim 14, wherein in an optical axis direction, the at least one of the electronic components disposed on the substrate front surface is overlapping with the at least one of the electronic components disposed on the substrate back surface. ### Claim 16 (depends on 8) The camera module according to claim 8, further comprising at least one frame-shaped support element, wherein the support element is disposed on the outer edge of the filter element, and the molded base embeds at least a part of the support element. ### Claim 17 (depends on 8) The camera module according to claim 8, further comprising a filler, wherein the filler is held between the substrate back surface of the substrate and the non-photosensitive area of the photosensitive element, to fill a gap formed between the substrate back surface and the non-photosensitive area. ### Claim 18 (depends on 17) The camera module according to claim 17, wherein the filler is overlapping with an electronic component which is disposed on and conductively connected to the substrate front surface of the substrate in an optical axis direction. ### Claim 19 (depends on 17) The camera module according to claim 17, wherein the filler is protruding from the substrate toward an optical axis when viewed from an optical axis direction. ### Claim 20 (depends on 17) The camera module according to claim 17, wherein the filler is overlapping with the buffer portion in an optical axis direction.