# US 12,119,312 B2 · Device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,312 B2 - Document ID: US12119312B2 - Status: Granted - Kind: B2 - Application number: 18/223,525 - Filed: 2023-07-18 - Published: 2023-11-09 - Granted: 2024-10-15 - Earliest claimed: 2018-09-21 - Assignees: Advanced Semiconductor Engineering, Inc. - Applicants: Advanced Semiconductor Engineering, Inc. - Inventors: Cheng-Nan Lin; Wei-Tung Chang; Jen-Chieh Kao; Huei-Shyong Cho - Web page: https://patentgrep.com/patent/US12119312B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 21/065: {Patch antenna array} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H01Q 1/243: {with built-in antennas} - H10W 44/248: {for antennas} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad. ## Claims ### Claim 1 An electronic device, comprising: a circuit structure; an antenna structure disposed over the circuit structure; a conductive element configured to transmit a radio frequency (RF) signal between the circuit structure and the antenna structure; and an encapsulant encapsulating the conductive element and including an indented portion having a first lateral side surface spaced apart from the conductive element, wherein the encapsulant has a first upper surface connected to the antenna structure and a second upper surface, and the first lateral side surface of the indented portion extends between the first upper surface and the second upper surface of the encapsulant, wherein the encapsulant further has a second lateral side surface spaced apart from the first lateral side surface and contacting the conductive element, and wherein a length of the second lateral side surface is greater than a length of the first lateral side surface in a cross-sectional view perspective. ### Claim 2 (depends on 1) The electronic device as claimed in claim 1, wherein the second upper surface of the encapsulant is substantially aligned with an upper surface of the conductive element. ### Claim 3 (depends on 1) The electronic device as claimed in claim 1, wherein an elevation of the first upper surface of the encapsulant is higher than an elevation of an upper surface of the conductive element with respect to an upper surface of the circuit structure. ### Claim 4 (depends on 1) The electronic device as claimed in claim 1, wherein the conductive element has an upper surface and a lower surface, and a width of the upper surface is greater than a width of the lower surface in the cross-sectional view perspective. ### Claim 5 (depends on 4) The electronic device as claimed in claim 4, wherein the encapsulant has a through hole for accommodating the conductive element, and a width of an upper opening of the through hole is greater than the width of the upper surface of the conductive element in the cross-sectional view perspective. ### Claim 6 (depends on 5) The electronic device as claimed in claim 5, wherein the through hole of the encapsulant further has a lower opening, and the width of the upper opening is greater than a width of the lower opening in the cross-sectional view perspective. ### Claim 7 An electronic device, comprising: a circuit structure comprising a first dielectric layer having a first modulus; an antenna structure supported by the circuit structure and comprising a dielectric element having a second modulus different from the first modulus; a conductive element configured to transmit a radio frequency (RF) signal between the circuit structure and the antenna structure; and an encapsulant encapsulating the conductive element, wherein the circuit structure further comprises a conductive pad connected to the conductive element and the encapsulant, wherein the encapsulant has a through hole having an upper opening and a lower opening, and wherein in a cross-sectional view perspective, a width of the upper opening is greater than a width of the conductive pad, and a width of the lower opening is less than the width of the conductive pad. ### Claim 8 (depends on 7) The electronic device as claimed in claim 7, wherein the circuit structure further comprises a passivation layer connected to the encapsulant, the passivation layer has an opening exposing the conductive pad, and the passivation layer is spaced apart from the conductive element. ### Claim 9 (depends on 7) The electronic device as claimed in claim 7, wherein a dielectric constant (Dk) of the dielectric element is less than a dielectric constant of the first dielectric layer. ### Claim 10 (depends on 7) The electronic device as claimed in claim 7, wherein the encapsulant has a third modulus equal to or greater than the second modulus and less than the first modulus.