# US 12,119,293 B2 · Through electrode substrate and mounting substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,293 B2 - Document ID: US12119293B2 - Status: Granted - Kind: B2 - Application number: 17/497,261 - Filed: 2021-10-08 - Published: 2022-01-27 - Granted: 2024-10-15 - Earliest claimed: 2016-08-04 - Assignees: Dai Nippon Printing Co., Ltd. - Applicants: Dai Nippon Printing Co., Ltd. - Inventors: Shinji Maekawa; Hiroshi Kudo; Takamasa Takano; Hiroshi Mawatari; Masaaki Asano - Web page: https://patentgrep.com/patent/US12119293B2 ## CPC - H10P 72/74: {using temporarily an auxiliary support} - H10W 70/635: {Through-vias} - H05K 3/46: Manufacturing multilayer circuits - H10W 70/095: {of vias therein} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/692: Ceramics or glasses - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10W 70/69: Insulating materials thereof - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer. ## Claims ### Claim 1 A through electrode substrate comprising: a first side of the through electrode substrate; a second side of the through electrode substrate opposite the first side; a substrate including a first surface facing the first side, and a second surface facing the second side, the substrate being provided with a through hole; a through electrode positioned in the through hole of the substrate, the through electrode having a first end surface facing the first side and a second end surface facing the second side; and a first wiring structure including at least a first wiring layer positioned on the first surface of the substrate, and a second wiring layer positioned on the first wiring layer, wherein the first wiring layer has a first insulation layer provided with a first opening positioned on the first end surface of the through electrode, and a first electroconductive layer connected to the first end surface of the through electrode through the first opening of the first insulation layer, the second wiring layer has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer, the first electroconductive layer of the first wiring layer is connected to the first end surface at a position overlapped with the through hole of the substrate when seen along the normal direction of the first surface of the substrate, the first insulation layer of the first wiring layer includes at least an organic layer, which is in contact with the first end surface of the through electrode, the second insulation layer of the second wiring layer includes an inorganic layer having insulation properties, and the inorganic layer of the second insulation layer of the second wiring layer is positioned toward the first side relative to the organic layer of the first insulation layer of the first wiring layer. ### Claim 2 (depends on 1) The through electrode substrate according to claim 1, wherein the inorganic layer of the second insulation layer of the second wiring layer is in contact with the first electroconductive layer of the first wiring layer. ### Claim 3 (depends on 1) The through electrode substrate according to claim 1, wherein the inorganic layer of the second insulation layer of the second wiring layer at least partially covers the first electroconductive layer of the first wiring layer. ### Claim 4 (depends on 1) The through electrode substrate according to claim 1, wherein the second insulation layer of the second wiring layer further has an organic layer positioned toward the first side relative to the inorganic layer of the second insulation layer of the second wiring layer. ### Claim 5 (depends on 1) The through electrode substrate according to claim 1, wherein the first wiring structure further includes a third wiring layer positioned on the second wiring layer, the third wiring layer includes: a third insulation layer including an inorganic layer and an organic layer, the third insulation layer being provided with a third opening positioned on the second electroconductive layer of the second wiring layer; and a third electroconductive layer connected to the second electroconductive layer of the second wiring layer through the third opening of the third insulation layer, and the organic layer of the third insulation layer of the third wiring layer is positioned toward the first side relative to the inorganic layer of the third insulation layer of the third wiring layer. ### Claim 6 (depends on 1) The through electrode substrate according to claim 1, wherein the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate, and a second wiring layer positioned on the first wiring layer, the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer of the second wiring structure, the second wiring layer of the second wiring structure has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer of the second wiring structure, and the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer. ### Claim 7 (depends on 6) The through electrode substrate according to claim 6, wherein the second insulation layer of the second wiring layer of the second wiring structure includes an inorganic layer having insulation properties, and the inorganic layer of the second insulation layer of the second wiring layer of the second wiring structure at least partially covers the first electroconductive layer of the first wiring layer of the second wiring structure. ### Claim 8 (depends on 7) The through electrode substrate according to claim 7, wherein the number of layers of the second electroconductive layer included in the second wiring structure is smaller than the number of layers of the first electroconductive layer included in the first wiring structure, and the organic layer of the first wiring layer of the second wiring structure includes a portion that is not covered with the inorganic layer of the second wiring layer of the second wiring structure. ### Claim 9 (depends on 8) The through electrode substrate according to claim 8, wherein a ratio of a portion of the organic layer of the first wiring layer of the second wiring structure, which portion is covered with the inorganic layer of the second wiring layer of the second wiring structure, is lower than a ratio of a portion of the organic layer of the first wiring layer of the first wiring structure, which portion is covered with the inorganic layer of the second wiring layer of the first wiring structure. ### Claim 10 (depends on 1) The through electrode substrate according to claim 1, wherein the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate, the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer, the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer, and the first electroconductive layer and the organic layer of the first wiring layer of the second wiring structure is not covered with an inorganic layer having insulation properties. ### Claim 11 (depends on 1) The through electrode substrate according to claim 1, wherein the first insulation layer of the first wiring layer includes the inorganic layer positioned toward the first side relative to the organic layer. ### Claim 12 (depends on 11) The through electrode substrate according to claim 11, wherein the inorganic layer of the first insulation layer of the first wiring layer is at least partially in contact with the first electroconductive layer of the first wiring layer from the second side. ### Claim 13 (depends on 1) The through electrode substrate according to claim 1, wherein the organic layer contains at least polyimide, epoxy or acryl. ### Claim 14 (depends on 1) The through electrode substrate according to claim 1, wherein the inorganic layer contains at least silicon oxide or silicon nitride. ### Claim 15 (depends on 1) A mounting substrate comprising: the through electrode substrate according to claim 1; and an element loaded on the through electrode substrate.