# US 12,119,287 B2 · Chip package positioning and fixing structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,119,287 B2 - Document ID: US12119287B2 - Status: Granted - Kind: B2 - Application number: 17/288,618 - Filed: 2019-09-20 - Published: 2021-12-23 - Granted: 2024-10-15 - Earliest claimed: 2018-11-05 - Assignees: Hitachi Astemo, Ltd. - Applicants: Hitachi Astemo, Ltd. - Inventors: Binti Haridan Fatin Farhanah; Takayuki Yogo; Hiroyuki Abe - Web page: https://patentgrep.com/patent/US12119287B2 ## CPC - H10W 70/40: Leadframes - G01F 5/00: Measuring a proportion of the volume flow - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/3421: {Leaded components} - H05K 3/3494: Heating processes for reflow soldering - H10D 48/50: Devices controlled by mechanical forces, e.g. pressure - H10W 70/427: {Bent parts} - H10W 74/10: characterised by their shape or disposition - H10W 76/12: characterised by their shape - G01F 1/6845: {Micromachined devices} - G01F 15/04: of gases to be measured - H05K 2203/0165: Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing - H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste - H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment - H10W 72/07336: {Soldering or alloying} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01F: MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion. ## Claims ### Claim 1 A chip package positioning and fixing structure that positions and fixes, to a circuit board, a chip package in which a flow rate detection element is sealed with a resin so that a detection portion is at least exposed, wherein the chip package includes a solder fixation portion that fixes the chip package to the circuit board by soldering, and a positioning portion that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element than to the solder fixation portion. ### Claim 2 (depends on 1) The chip package positioning and fixing structure according to claim 1, wherein the positioning portion has a package concave portion or a package convex portion formed in the chip package, and a substrate convex portion formed in the circuit board and fitted into the package concave portion or a substrate concave portion fitted into the package convex portion. ### Claim 3 (depends on 1) The chip package positioning and fixing structure according to claim 1, wherein the chip package includes a package body having a base end portion at which the solder fixation portion is provided and a tip portion at which the positioning portion is provided, the positioning portion has a convex portion formed in the tip portion of the package body, the solder fixation portion has a connection terminal protruding from the base end portion of the package body, and the convex portion and the connection terminal are positioned on a virtual plane including a mounting surface of the circuit board. ### Claim 4 (depends on 3) The chip package positioning and fixing structure according to claim 3, wherein the convex portion abuts on a waste substrate that supports the circuit board. ### Claim 5 (depends on 3) The chip package positioning and fixing structure according to claim 3, wherein the convex portion is formed of the resin. ### Claim 6 (depends on 4) The chip package positioning and fixing structure according to claim 4, wherein the chip package has a lead frame on which the flow rate detection element is mounted, and the convex portion is formed by protruding a part of the lead frame from the package body. ### Claim 7 (depends on 6) The chip package positioning and fixing structure according to claim 6, wherein the convex portion has an L shape in which the convex portion protrudes from the package body along a frame surface of the lead frame, is bent at the tip portion, and protrudes to a connection surface side of the connection terminal, and an insertion hole into which the tip portion of the convex portion is inserted is provided in the waste substrate. ### Claim 8 (depends on 3) The chip package positioning and fixing structure according to claim 3, wherein the convex portion is adhered to a housing of a physical quantity detection device when the circuit board is attached to the housing.